The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 21, 1999
Filed:
Feb. 12, 1998
Applicant:
Inventors:
Assignee:
International Business Machines Corporation, Armonk, NY (US);
Primary Examiner:
Int. Cl.
CPC ...
H01R / ;
U.S. Cl.
CPC ...
361774 ; 257737 ; 361776 ;
Abstract
A flexible interconnect for flexibly connecting an integrated circuit chip to a substrate. The flexible interconnect includes a flexible core, formed of a polymeric material, fully covered by a layer of an electrically conductive metal. A layer of a compliant material is provided beneath the input/output pad of the substrate and/or integrated circuit chip to reduce mechanical stresses on the flexible interconnect. The substrate and integrated circuit chip may include depressions to receive ends of the flexible interconnect. In one embodiment, the flexible interconnect may be tubular in shape and positioned on a protrusion formed on the substrate.