The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 04, 2010
Filed:
Mar. 16, 2007
William L. Brodsky, Binghamton, NY (US);
Peter J. Brofman, Hopewell Junction, NY (US);
James A. Busby, New Paltz, NY (US);
Bruce J. Chamberlin, Vestal, NY (US);
Scott A. Cummings, Charlotte, VT (US);
David L. Edwards, Poughkeepsie, NY (US);
Thomas J. Fleischman, Poughkeepsie, NY (US);
Michael J. Griffin, Iv, Poughkeepsie, NY (US);
Sushumna Iruvanti, Wappingers Falls, NY (US);
David C. Long, Wappingers Falls, NY (US);
Jennifer V. Muncy, Ridgefield, CT (US);
Robin A. Susko, Owego, NY (US);
William L. Brodsky, Binghamton, NY (US);
Peter J. Brofman, Hopewell Junction, NY (US);
James A. Busby, New Paltz, NY (US);
Bruce J. Chamberlin, Vestal, NY (US);
Scott A. Cummings, Charlotte, VT (US);
David L. Edwards, Poughkeepsie, NY (US);
Thomas J. Fleischman, Poughkeepsie, NY (US);
Michael J. Griffin, IV, Poughkeepsie, NY (US);
Sushumna Iruvanti, Wappingers Falls, NY (US);
David C. Long, Wappingers Falls, NY (US);
Jennifer V. Muncy, Ridgefield, CT (US);
Robin A. Susko, Owego, NY (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
Methods, apparatus and assemblies for enhancing heat transfer in electronic components using a flexible thermal pillow. The flexible thermal pillow has a thermally conductive material sealed between top and bottom conductive layers, with the bottom layer having a flexible reservoir residing on opposing sides of a central portion of the pillow that has a gap. The pillow may have roughened internal surfaces to increase an internal surface area within the pillow for enhanced heat dissipation. In an electronic assembly, the central portion of the pillow resides between a heat sink and heat-generating component for the thermal coupling there-between. During thermal cycling, the flexible reservoir of the pillow expands to retain thermally conductive material extruded from the gap, and then contracts to force such extruded material back into the gap. An external pressure source may contact the pillow for further forcing the extruded thermally conductive material back into the gap.