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For the Inventor, By the Inventor

Thousand Oaks, CA, United States of America

Robert L Borwick, Iii

This inventor holds 26 USPTO granted patents and 2 published patent applications, primarily in Microelectromechanical Systems. Top assignees: Teledyne Scientific and Imaging, LLC, Teledyne Licensing, LLC, Rockwell Scientific Licensing LLC. Active years: 2004-2019.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Robert L Borwick, Iii. Retrieved from https://idiyas.com/inventor/robert-l-borwick-iii

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 26 

% Patents Active = 80.8

Average Co-Inventor Count = 3.8

ph-index = 9

Forward Citations = 265(Granted Patents)


Company Filing History:

goldMedal16 out of 202 
 
Teledyne Scientific and Imaging, LLC
 patents
silverMedal7 out of 66 
 
Teledyne Licensing, LLC
 patents
bronzeMedal3 out of 44 
 
Rockwell Scientific Licensing LLC
 patents

Years Active: 2004-2019

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Areas of Expertise:
Microelectromechanical Systems
Thermal Isolation
Compact Atomic Devices
Silicon Waveguides
Integrated Coils
Optical Interrogators
MEMS Devices
Fluid Diagnostics
High-Aspect Ratio Vias
Micromirror Apparatus
Chip-Scale Optics
Through-Substrate Vias
26 patents (USPTO):Explore Patents
1. 10416246 - Physics package for compact atomic device (2019-09-17),
2. 10325707 - Integrated field coil for compact atomic devices (2019-06-18),
3. 9607748 - Micro-fabricated integrated coil and magnetic circuit and method of manufacturing thereof (2017-03-28),
4. 8995800 - Method of fabricating silicon waveguides with embedded active circuitry (2015-03-31),
5. 8937513 - Micro-scale system to provide thermal isolation and electrical communication between substrates (2015-01-20),
6. 8826514 - Microfabricated inductors with through-wafer vias (2014-09-09),
7. 8654332 - Chip-scale optics module for optical interrogators (2014-02-18),
8. 8614610 - Ruggedized waveguide encapsulation fixture for receiving a compressed waveguide component (2013-12-24),
9. 8456249 - Micro-scale system to provide thermal isolation and electrical communication between substrates (2013-06-04),
10. 8319156 - System for heating a vapor cell (2012-11-27),
11. 8258884 - System for charging a vapor cell (2012-09-04),
12. 8187972 - Through-substrate vias with polymer fill and method of fabricating same (2012-05-29),
13. 8088667 - Method of fabricating vertical capacitors in through-substrate vias (2012-01-03),
14. 8080736 - Non-planar microcircuit structure and method of fabricating same (2011-12-20),
15. 7810379 - High temperature microelectromechanical (MEM) devices (2010-10-12),

Title: Robert L. Borwick, III: Innovator in Atomic Device Technology

Introduction

Robert L. Borwick, III is a prominent inventor based in Thousand Oaks, California. With a remarkable portfolio of 26 patents, Borwick has made significant contributions to the field of atomic device technology. His inventions reflect a deep understanding of physics and engineering, making advancements that enhance the functionality and efficiency of compact atomic devices.

Latest Patents

Among his most recent innovations are two notable patents. The first is a "Physics package for compact atomic device," which features an apparatus comprising a container with multiple slots and an open end. This invention includes a first vapor cell carrier that is slidably seated in one of the slots, along with a vapor cell coupled to the carrier, and a lid that sealably encloses the open end, effectively sealing the vapor cell within the container.

The second patent, titled "Integrated field coil for compact atomic devices," describes a magnetic field coil assembly designed with multiple stacked dielectric layers. Each layer contains a partial-loop conductive trace, which is interconnected via a via that extends through the layers. This innovative design allows for a continuous coil to be formed around a vapor cell, generating a magnetic field when a current is applied, thereby enhancing the performance of compact atomic devices.

Career Highlights

Robert L. Borwick, III has been associated with distinguished companies, notably Teledyne Scientific and Imaging, LLC and Teledyne Licensing, LLC. His work has significantly impacted the development of next-generation atomic devices, proving his importance in the field.

Collaborations

Throughout his career, Borwick has collaborated with several talented professionals, including Jeffrey DeNatale and Philip Stupar. These partnerships have allowed for the exchange of innovative ideas and have been instrumental in advancing their collective work in atomic technology.

Conclusion

In summary, Robert L. Borwick, III stands out as a key inventor in the realm of atomic devices, with a proven track record of innovation as evidenced by his numerous patents. His recent work continues to push the boundaries of technology, making substantial advancements that are likely to influence future developments in the industry.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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