The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 09, 2014
Filed:
Feb. 14, 2011
Alexandros Papavasiliou, Thousand Oaks, CA (US);
Jeffrey F. Denatale, Thousand Oaks, CA (US);
Philip A. Stupar, Oxnard, CA (US);
Robert L. Borwick, Iii, Thousand Oaks, CA (US);
Alexandros Papavasiliou, Thousand Oaks, CA (US);
Jeffrey F. DeNatale, Thousand Oaks, CA (US);
Philip A. Stupar, Oxnard, CA (US);
Robert L. Borwick, III, Thousand Oaks, CA (US);
Teledyne Scientific & Imaging, LLC, Thousand Oaks, CA (US);
Abstract
Microfabricated inductors with through-wafer vias and including a first wafer and a second wafer, each wafer having a plurality of metal fillings therein, and a plurality of metal conductors connecting the plurality of metal fillings together to form a spiral. A method for producing an inductor including steps of forming a first plurality of vias in a first substrate, filling the first plurality of vias in the first substrate with a first plurality of metal fillings, forming a first plurality of metal conductors, connecting pairs of the first plurality of metal fillings together using the first plurality of metal conductors to form a spiral, performing the foregoing steps similarly on a second substrate formed with a second plurality of vias filled with a second plurality of metal fillings, and bonding the first substrate with the second substrate.