Ramin Farjadrad

This inventor holds 80 USPTO granted patents and 3 published patent applications and 1 EPO patent, primarily in Multi-Chip Modules (CPC class H04L). Top assignees: Aquantia Corporation, Eliyan Corporation, Marvell Asia Pte., Ltd.. Active years: 2009-2026.

USPTO Granted Patents = 80 (Patent Applications = 3)

% Patents Active = 86.3

EPO Patents = 1 (Patent Applications = 1)

Average Co-Inventor Count = 1.7

ph-index = 14

Forward Citations = 525(Granted Patents)

Forward Citations (Not Self Cited) = 348(Dec 10, 2025)

Inventors with similar research interests:

Location History:

Mt. View, CA (US) (2009 - 2010)
Mountain View, CA (US) (2010)
San Jose, CA (US) (2014)
Los Altos, CA (US) (2009 - 2024)

Company Filing History:

Marvell Asia Pte., Ltd.

5. 2 out of 834,411

Other

patents

Years Active: 2009-2026

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Areas of Expertise:

Multi-Chip Module

High-Speed Signaling

Chiplet Architecture

Unified Memory

Die-to-Die Interfaces

Scalable Memory

Crosstalk Reduction

Traffic Monitoring

Data Transmission

System-in-Package

Ethernet Coding

Memory Chiplet

80 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 12745658 - Method and apparatus to reduce complexity and cost for multi-chip modules (MCMs) (2026-09-22),

2. 12726208 - Efficient clocking scheme for die-to-die connectivity (2026-09-01),

3. 12717996 - Multi-chip module (MCM) with multi-port unified memory (2026-08-25),

4. 12699514 - Multi-chip module (MCM) with multi-port unified memory (2026-08-04),

5. 12667022 - Complex system-in-package architectures leveraging high-bandwidth long-reach die-to-die connectivity over package substrates (2026-06-23),

6. 12650936 - Chiplet-based multi-chip module with die-to-die (D2D) interface that employs bandwidth balancing circuitry (2026-06-09),

7. 12602531 - Multi-chip module (MCM) with multi-port unified memory (2026-04-14),

8. 12596667 - Multi-chip module including integrated circuit with receiver circuitry implementing transmit signal cancellation (2026-04-07),

9. 12579093 - Chiplet gearbox for low-cost multi-chip module applications (2026-03-17),

10. 12525540 - Multi-chip module (MCM) with scalable high bandwidth memory (2026-01-13),

11. 12438095 - Complex system-in-package architectures leveraging high-bandwidth long-reach die-to-die connectivity over package substrates (2025-10-07),

12. 12430268 - Efficient signaling scheme for high-speed ultra short reach interfaces (2025-09-30),

13. 12341569 - Wireline link with crosstalk reduction based on controlled channel delay (2025-06-24),

14. 12314567 - Multi-chip module (MCM) with multi-port unified memory (2025-05-27),

15. 12248679 - Multi-chip module (MCM) with multi-port unified memory (2025-03-11),

Title: The Innovator Spotlight: Ramin Farjadrad

Introduction: Ramin Farjadrad, a prolific inventor based in Los Altos, CA, has made significant contributions to the field of integrated circuit technology with an impressive portfolio of 54 patents to his name.

Latest Patents: Among his recent innovations is a groundbreaking multi-chip module with power-efficient hybrid circuitry, designed to enhance communication efficiency between integrated circuit chips. Another notable invention is the multi-chip module with multi-port unified memory, revolutionizing semiconductor devices and packaging architectures.

Career Highlights: Ramin Farjadrad has a rich professional background, having worked with top-tier companies such as Aquantia Corporation and Marvell Asia Pte., Ltd. His expertise and dedication have been instrumental in driving advancements in the tech industry.

Collaborations: Throughout his career, Ramin Farjadrad has collaborated with esteemed colleagues such as Ramin Shirani and Hossein Sedarat, pooling their talents to push the boundaries of innovation in integrated circuit design and development.

Conclusion: Ramin Farjadrad's relentless pursuit of excellence and groundbreaking inventions have solidified his reputation as a visionary in the realm of integrated circuit technology. His contributions continue to shape the future of the industry, paving the way for even more remarkable advancements on the horizon.