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Los Altos, CA, United States of America

Ramin Farjadrad

USPTO Granted Patents = 70 (Patent Applications = 3)

EPO Patents = 1 (Patent Applications = 1)

Average Co-Inventor Count = 1.7

ph-index = 14

Forward Citations = 460(Granted Patents)

Forward Citations (Not Self Cited) = 348(Dec 10, 2025)

Inventors with similar research interests:

Location History:

Mt. View, CA (US) (2009 - 2010)
Mountain View, CA (US) (2010)
San Jose, CA (US) (2014)
Los Altos, CA (US) (2009 - 2024)

Company Filing History:

Aquantia Corporation

19 out of 1,128

Marvell Asia Pte., Ltd.

Eliyan Corporation

4. 1 out of 2,867

5. 2 out of 832,843

Other

patents

Years Active: 2009-2025

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Areas of Expertise:

System-In-Package Architectures

High-Bandwidth Connectivity

Multi-Chip Module

Chiplet Interconnect

Universal Memory Interface

Efficient Signaling Schemes

In-Vehicle Networks

Data Transmission Optimization

Ethernet Coding

Power-Efficient Hybrid Circuitry

SNR Improvement Methods

RF Interference Rejection

70 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 12438095 - Complex system-in-package architectures leveraging high-bandwidth long-reach die-to-die connectivity over package substrates (2025-10-07),

2. 12430268 - Efficient signaling scheme for high-speed ultra short reach interfaces (2025-09-30),

3. 12341569 - Wireline link with crosstalk reduction based on controlled channel delay (2025-06-24),

4. 12314567 - Multi-chip module (MCM) with multi-port unified memory (2025-05-27),

5. 12248679 - Multi-chip module (MCM) with multi-port unified memory (2025-03-11),

6. 12248421 - Chiplet gearbox for low-cost multi-chip module applications (2025-03-11),

7. 12248419 - Interface conversion circuitry for universal chiplet interconnect express (UCIe) (2025-03-11),

8. 12248418 - Efficient signaling scheme for high-speed ultra short reach interfaces (2025-03-11),

9. 12248413 - Universal memory interface utilizing die-to-die (D2D) interfaces between chiplets (2025-03-11),

10. 12204840 - Multi-chip module (MCM) with multi-port unified memory (2025-01-21),

11. 12204759 - Multi-chip module (MCM) with multi-port unified memory (2025-01-21),

12. 12204482 - Memory chiplet with efficient mapping of memory-centric interface to die-to-die (D2D) unit interface modules (2025-01-21),

13. 12190038 - Multi-chip module (MCM) with multi-port unified memory (2025-01-07),

14. 12182040 - Multi-chip module (MCM) with scalable high bandwidth memory (2024-12-31),

15. 12154387 - Self-diagnosis for in-vehicle networks (2024-11-26),

Title: The Innovator Spotlight: Ramin Farjadrad

Introduction: Ramin Farjadrad, a prolific inventor based in Los Altos, CA, has made significant contributions to the field of integrated circuit technology with an impressive portfolio of 54 patents to his name.

Latest Patents: Among his recent innovations is a groundbreaking multi-chip module with power-efficient hybrid circuitry, designed to enhance communication efficiency between integrated circuit chips. Another notable invention is the multi-chip module with multi-port unified memory, revolutionizing semiconductor devices and packaging architectures.

Career Highlights: Ramin Farjadrad has a rich professional background, having worked with top-tier companies such as Aquantia Corporation and Marvell Asia Pte., Ltd. His expertise and dedication have been instrumental in driving advancements in the tech industry.

Collaborations: Throughout his career, Ramin Farjadrad has collaborated with esteemed colleagues such as Ramin Shirani and Hossein Sedarat, pooling their talents to push the boundaries of innovation in integrated circuit design and development.

Conclusion: Ramin Farjadrad's relentless pursuit of excellence and groundbreaking inventions have solidified his reputation as a visionary in the realm of integrated circuit technology. His contributions continue to shape the future of the industry, paving the way for even more remarkable advancements on the horizon.

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