The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 27, 2025

Filed:

May. 02, 2024
Applicant:

Eliyan Corporation, Santa Clara, CA (US);

Inventors:

Ramin Farjadrad, Los Altos, CA (US);

Syrus Ziai, Los Altos, CA (US);

Assignee:

Eliyan Corporation, Santa Clara, CA (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
G06F 3/06 (2006.01);
U.S. Cl.
CPC ...
G06F 3/0611 (2013.01); G06F 3/0629 (2013.01); G06F 3/0673 (2013.01);
Abstract

Semiconductor devices, packaging architectures and associated methods are disclosed. In one embodiment, a chiplet-based multi-chip module (MCM) is disclosed. The chiplet-based MCM includes a package substrate and a first processing integrated circuit (IC) chiplet disposed on the package substrate. A second processing IC chiplet is disposed on the package substrate. At least one first row multi-port memory chiplet is disposed on the package substrate and coupled between the first processing IC chiplet and the second IC processing chiplet. Data transfers between the first processing IC chiplet and a destination IC chiplet are routed through the at least one first row multi-port memory chiplet.


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