For the Inventor, By the Inventor

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Santa Clara, CA, United States of America

Eliyan Corporation

USPTO Granted Patents = 30

Trademarks = 1

Forward Citations = 124

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9 inventors (with patents filed for the assignee):

Ramin Farjadrad (24 out of 80 patents)

Syrus Ziai (14 out of 34 patents)

Curtis McAllister (5 out of 5 patents)

4. Kevin Donnelly (4 out of 4 patents)

5. Mohsen F Rad (2 out of 2 patents)

6. Farjadrad Ramin (1 out of 1 patent)

7. Paul Langner (1 out of 1 patent)

8. Paul Hylander (1 out of 1 patent)

9. Nhan Nguyen (1 out of 1 patent)

Core Competencies:

Multi-Chip Module

Die-to-Die Connectivity

Chiplet Architecture

High-Bandwidth Memory

Memory Interface

System-in-Package

Error Correction

Bandwidth Balancing

3D Packaging

Cyclic Redundancy Check

Universal Memory

Interface Conversion

30 patents: Sort by Forward Citations

1. 12745658 - Method and apparatus to reduce complexity and cost for multi-chip modules (MCMs) (2026-09-22),

2. 12726208 - Efficient clocking scheme for die-to-die connectivity (2026-09-01),

3. 12717996 - Multi-chip module (MCM) with multi-port unified memory (2026-08-25),

4. 12699514 - Multi-chip module (MCM) with multi-port unified memory (2026-08-04),

5. 12667022 - Complex system-in-package architectures leveraging high-bandwidth long-reach die-to-die connectivity over package substrates (2026-06-23),

6. 12650936 - Chiplet-based multi-chip module with die-to-die (D2D) interface that employs bandwidth balancing circuitry (2026-06-09),

7. 12602531 - Multi-chip module (MCM) with multi-port unified memory (2026-04-14),

8. 12579093 - Chiplet gearbox for low-cost multi-chip module applications (2026-03-17),

9. 12525540 - Multi-chip module (MCM) with scalable high bandwidth memory (2026-01-13),

10. 12524300 - Die-to-die (D2D) interface with cyclic redundancy check (CRC) error correction capability (2026-01-13),

11. 12494469 - Low cost solution for 2.5D and 3D packaging using USR chiplets (2025-12-09),

12. 12438095 - Complex system-in-package architectures leveraging high-bandwidth long-reach die-to-die connectivity over package substrates (2025-10-07),

13. 12314567 - Multi-chip module (MCM) with multi-port unified memory (2025-05-27),

14. 12248679 - Multi-chip module (MCM) with multi-port unified memory (2025-03-11),

15. 12248421 - Chiplet gearbox for low-cost multi-chip module applications (2025-03-11),

Company Overview

Eliyan Corporation, based in Santa Clara, California, specializes in advanced technology solutions, focusing on the development and manufacturing of innovative electronic systems and components. The company is engaged in research across various domains, including semiconductor technology, IoT applications, and integrated circuit design. Eliyan aims to enhance connectivity and efficiency in multiple industries, leveraging cutting-edge technologies to meet the evolving needs of its clients and partners globally.

Profile summary synthesized from public USPTO records and patent filings.

Company Badge

USPTO Data Jan 1 1976 - Oct 20 2026

30 Patents

#116 in Santa Clara, CA

#2,682 in California

#11,279 in US

#21,912 in the World

Santa Clara, CA, United States of America

Eliyan Corporation

Forward Citations = 124

9 inventors:

Ramin Farjadrad (24 out of 80 patents)

Syrus Ziai (14 out of 34 patents)

Curtis McAllister (5 out of 5 patents)

4. Kevin Donnelly (4 out of 4 patents)

5. Mohsen F Rad (2 out of 2 patents)

IDiyas Innovation Intelligence. (2026). Company Patent Portfolio: Eliyan Corporation. Retrieved from https://idiyas.com/company/eliyan

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]

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