For the Inventor, By the Inventor

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Santa Clara, CA, United States of America

Eliyan Corporation

USPTO Granted Patents = 30

Trademarks = 1

Forward Citations = 124

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9 inventors (with patents filed for the assignee):

Ramin Farjadrad (24 out of 80 patents)

Syrus Ziai (14 out of 34 patents)

Curtis McAllister (5 out of 5 patents)

4. Kevin Donnelly (4 out of 4 patents)

5. Mohsen F Rad (2 out of 2 patents)

6. Farjadrad Ramin (1 out of 1 patent)

7. Paul Langner (1 out of 1 patent)

8. Paul Hylander (1 out of 1 patent)

9. Nhan Nguyen (1 out of 1 patent)

30 patents: Sort by Forward Citations

1. 12745658 - Method and apparatus to reduce complexity and cost for multi-chip modules (MCMs) (2026-09-22),

2. 12726208 - Efficient clocking scheme for die-to-die connectivity (2026-09-01),

3. 12717996 - Multi-chip module (MCM) with multi-port unified memory (2026-08-25),

4. 12699514 - Multi-chip module (MCM) with multi-port unified memory (2026-08-04),

5. 12667022 - Complex system-in-package architectures leveraging high-bandwidth long-reach die-to-die connectivity over package substrates (2026-06-23),

6. 12650936 - Chiplet-based multi-chip module with die-to-die (D2D) interface that employs bandwidth balancing circuitry (2026-06-09),

7. 12602531 - Multi-chip module (MCM) with multi-port unified memory (2026-04-14),

8. 12579093 - Chiplet gearbox for low-cost multi-chip module applications (2026-03-17),

9. 12525540 - Multi-chip module (MCM) with scalable high bandwidth memory (2026-01-13),

10. 12524300 - Die-to-die (D2D) interface with cyclic redundancy check (CRC) error correction capability (2026-01-13),

11. 12494469 - Low cost solution for 2.5D and 3D packaging using USR chiplets (2025-12-09),

12. 12438095 - Complex system-in-package architectures leveraging high-bandwidth long-reach die-to-die connectivity over package substrates (2025-10-07),

13. 12314567 - Multi-chip module (MCM) with multi-port unified memory (2025-05-27),

14. 12248679 - Multi-chip module (MCM) with multi-port unified memory (2025-03-11),

15. 12248421 - Chiplet gearbox for low-cost multi-chip module applications (2025-03-11),

Eliyan Corporation is a leading technology company specializing in innovative software solutions. With a focus on digital transformation, our team of experts helps businesses streamline operations, increase productivity, and drive growth. We offer a wide range of services including custom software development, cloud computing, and cyber security. Our mission is to empower organizations with the tools they need to succeed in today's digital age.

This text is generated by artificial intelligence and may not be accurate.

Company Badge

USPTO Data Jan 1 1976 - Sep 29 2026

30 Patents

#116 in Santa Clara, CA

#2,677 in California

#11,249 in US

#21,840 in the World

Santa Clara, CA, United States of America

Eliyan Corporation

Forward Citations = 124

9 inventors:

Ramin Farjadrad (24 out of 80 patents)

Syrus Ziai (14 out of 34 patents)

Curtis McAllister (5 out of 5 patents)

4. Kevin Donnelly (4 out of 4 patents)

5. Mohsen F Rad (2 out of 2 patents)

Please report any incorrect information to [email protected]

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