The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 04, 2026
Filed:
Oct. 07, 2024
Eliyan Corporation, Santa Clara, CA (US);
Ramin Farjadrad, Los Altos, CA (US);
Syrus Ziai, Los Altos, CA (US);
Eliyan Corp., Santa Clara, CA (US);
Abstract
A chiplet-based multi-chip module (MCM) comprises a package substrate that is separate from a base substrate. A first integrated circuit (IC) chiplet couples to the package substrate and comprises a first memory interface that transmits memory access information to carry out a memory operation. A first memory chiplet couples to the package substrate and comprises a logic base die and at least one memory die stacked on the logic base die. The logic base die comprises a first port to receive the memory access information from the first memory interface of the first IC chiplet, a second port to communicate with a third IC chiplet, a third port to communicate with the at least one memory die, and in-memory processing circuitry to control a transfer of the memory access information from the first port to the second port or the third port via a packet-switched protocol.