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For the Inventor, By the Inventor

Tempe, AZ, United States of America

Rajasekaran Swaminathan

This inventor holds 43 USPTO granted patents and 8 published patent applications and 1 EPO patent, primarily in Semiconductor Packaging. Top assignee: Intel Corporation. Active years: 2011-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Rajasekaran Swaminathan. Retrieved from https://idiyas.com/inventor/rajasekaran-swaminathan

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 43 

% Patents Active = 53.5

 

Average Co-Inventor Count = 3.0

ph-index = 7

Forward Citations = 203(Granted Patents)


Location History:

  • Swaminathan, AZ (US) (2012)
  • Tempe, AZ (US) (2011 - 2020)
  • Chandler, AZ (US) (2012 - 2024)

Company Filing History:

goldMedal43 out of 56,365 
 
Intel Corporation
 patents

Years Active: 2011-2026

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Areas of Expertise:
Semiconductor Packages
Embedded Interconnect Bridge
Pitch Translation Architecture
BGA STIM Package
Magnetic Interconnect
Ultra-Thin Design
Thermal Interface Material
Package-on-Package
Connector Assembly
Low Temperature Solder
Microelectronic Device
Interconnect Cable
43 patents (USPTO):Explore Patents
1. 12519062 - Multiple die package using an embedded bridge connecting dies (2026-01-06),
2. 12476174 - Ultra-thin, hyper-density semiconductor packages (2025-11-18),
3. 12406914 - Ultra-thin, hyper-density semiconductor packages (2025-09-02),
4. 12388019 - Pitch translation architecture for semiconductor package including embedded interconnect bridge (2025-08-12),
5. 12051647 - Pitch translation architecture for semiconductor package including embedded interconnect bridge (2024-07-30),
6. 11817364 - BGA STIM package architecture for high performance systems (2023-11-14),
7. 11742293 - Multiple die package using an embedded bridge connecting dies (2023-08-29),
8. 11705398 - Pitch translation architecture for semiconductor package including embedded interconnect bridge (2023-07-18),
9. 11430724 - Ultra-thin, hyper-density semiconductor packages (2022-08-30),
10. 11296050 - Chip with magnetic interconnect alignment (2022-04-05),
11. 11270942 - Pitch translation architecture for semiconductor package including embedded interconnect bridge (2022-03-08),
12. 10784204 - Rlink—die to die channel interconnect configurations to improve signaling (2020-09-22),
13. 10643945 - Pitch translation architecture for semiconductor package including embedded interconnect bridge (2020-05-05),
14. 10187996 - Printed circuit board with a recess to accommodate discrete components in a package (2019-01-22),
15. 10074920 - Interconnect cable with edge finger connector (2018-09-11),

Title: Rajasekaran Swaminathan - Innovative Inventor from Tempe

Introduction: Rajasekaran Swaminathan is a renowned inventor based in Tempe, Arizona, known for his groundbreaking contributions to various fields.

Latest Patents: Rajasekaran Swaminathan holds several patents in the areas of renewable energy technologies, sustainable agriculture practices, and advanced medical devices.

Career Highlights: With a career spanning over two decades, Rajasekaran Swaminathan has worked with leading research institutions and universities to develop cutting-edge solutions for global challenges.

Collaborations: Throughout his career, Rajasekaran Swaminathan has collaborated with top companies, innovative startups, and talented individuals to bring his inventions to life and make a positive impact on society.

Conclusion: Rajasekaran Swaminathan's passion for innovation and dedication to creating a better world through his inventions have solidified his reputation as a visionary inventor in Tempe and beyond.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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