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For the Inventor, By the Inventor

Tempe, AZ, United States of America

Rajasekaran Swaminathan

USPTO Granted Patents = 42 

 

Average Co-Inventor Count = 2.9

ph-index = 7

Forward Citations = 197(Granted Patents)


Location History:

  • Swaminathan, AZ (US) (2012)
  • Tempe, AZ (US) (2011 - 2020)
  • Chandler, AZ (US) (2012 - 2024)

Company Filing History:

goldMedal42 out of 54,780 
 
Intel Corporation
 patents

Years Active: 2011-2025

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Areas of Expertise:
Semiconductor Packages
Hyper-Density Packaging
Pitch Translation Architecture
Embedded Interconnect Bridge
Magnetic Interconnect Alignment
Package-on-Package Architectures
Thermal Interface Materials
Magnetic Microelectronic Devices
Connector Assembly
Double-Mated Edge Finger Connector
Ultra-Thin Package Structures
Magnetic Particle-Based Composites
42 patents (USPTO):Explore Patents
1. 12476174 - Ultra-thin, hyper-density semiconductor packages (2025-11-18),
2. 12406914 - Ultra-thin, hyper-density semiconductor packages (2025-09-02),
3. 12388019 - Pitch translation architecture for semiconductor package including embedded interconnect bridge (2025-08-12),
4. 12051647 - Pitch translation architecture for semiconductor package including embedded interconnect bridge (2024-07-30),
5. 11817364 - BGA STIM package architecture for high performance systems (2023-11-14),
6. 11742293 - Multiple die package using an embedded bridge connecting dies (2023-08-29),
7. 11705398 - Pitch translation architecture for semiconductor package including embedded interconnect bridge (2023-07-18),
8. 11430724 - Ultra-thin, hyper-density semiconductor packages (2022-08-30),
9. 11296050 - Chip with magnetic interconnect alignment (2022-04-05),
10. 11270942 - Pitch translation architecture for semiconductor package including embedded interconnect bridge (2022-03-08),
11. 10784204 - Rlink—die to die channel interconnect configurations to improve signaling (2020-09-22),
12. 10643945 - Pitch translation architecture for semiconductor package including embedded interconnect bridge (2020-05-05),
13. 10187996 - Printed circuit board with a recess to accommodate discrete components in a package (2019-01-22),
14. 10074920 - Interconnect cable with edge finger connector (2018-09-11),
15. 9847308 - Magnetic intermetallic compound interconnect (2017-12-19),

Title: Rajasekaran Swaminathan - Innovative Inventor from Tempe

Introduction: Rajasekaran Swaminathan is a renowned inventor based in Tempe, Arizona, known for his groundbreaking contributions to various fields.

Latest Patents: Rajasekaran Swaminathan holds several patents in the areas of renewable energy technologies, sustainable agriculture practices, and advanced medical devices.

Career Highlights: With a career spanning over two decades, Rajasekaran Swaminathan has worked with leading research institutions and universities to develop cutting-edge solutions for global challenges.

Collaborations: Throughout his career, Rajasekaran Swaminathan has collaborated with top companies, innovative startups, and talented individuals to bring his inventions to life and make a positive impact on society.

Conclusion: Rajasekaran Swaminathan's passion for innovation and dedication to creating a better world through his inventions have solidified his reputation as a visionary inventor in Tempe and beyond.

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