The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 22, 2019

Filed:

Mar. 15, 2017
Applicant:

Intel Corporation, Santa Clara, CA (US);

Inventors:

Rajasekaran Swaminathan, Chandler, AZ (US);

Ram S. Viswanath, Phoenix, AZ (US);

Assignee:

Intel Corporation, Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/18 (2006.01); H05K 1/11 (2006.01); H05K 3/00 (2006.01); H05K 3/30 (2006.01); H05K 3/46 (2006.01);
U.S. Cl.
CPC ...
H05K 1/183 (2013.01); H05K 1/113 (2013.01); H05K 3/0014 (2013.01); H05K 3/303 (2013.01); H05K 3/46 (2013.01); H05K 2201/10628 (2013.01); H05K 2201/10719 (2013.01); H05K 2201/10734 (2013.01);
Abstract

Embodiments of the present disclosure provide techniques for a printed circuit board (PCB) with a recess to accommodate discrete components of a package attachable to the PCB, in accordance with some embodiments. In one embodiment, a PCB may include a recess disposed in at least a portion of the PCB, to receive at least a portion of a package. The package may be attachable to the PCB via a plurality of connectors. The connectors may be disposed on a side of the package that faces the PCB. The portion of the package may include one or more discrete components disposed on the side of the package that faces the PCB. The recess may have a depth to accommodate those discrete components that have a height that is greater than a height of the connectors. Other embodiments may be described and/or claimed.


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