Average Co-Inventor Count = 2.97
ph-index = 7
The patent ph-index is calculated by counting the number of publications for which an author has been cited by other authors at least that same number of times.
Company Filing History:
1. Intel Corporation (43 from 54,858 patents)
43 patents:
1. 12519062 - Multiple die package using an embedded bridge connecting dies
2. 12476174 - Ultra-thin, hyper-density semiconductor packages
3. 12406914 - Ultra-thin, hyper-density semiconductor packages
4. 12388019 - Pitch translation architecture for semiconductor package including embedded interconnect bridge
5. 12051647 - Pitch translation architecture for semiconductor package including embedded interconnect bridge
6. 11817364 - BGA STIM package architecture for high performance systems
7. 11742293 - Multiple die package using an embedded bridge connecting dies
8. 11705398 - Pitch translation architecture for semiconductor package including embedded interconnect bridge
9. 11430724 - Ultra-thin, hyper-density semiconductor packages
10. 11296050 - Chip with magnetic interconnect alignment
11. 11270942 - Pitch translation architecture for semiconductor package including embedded interconnect bridge
12. 10784204 - Rlink—die to die channel interconnect configurations to improve signaling
13. 10643945 - Pitch translation architecture for semiconductor package including embedded interconnect bridge
14. 10187996 - Printed circuit board with a recess to accommodate discrete components in a package
15. 10074920 - Interconnect cable with edge finger connector