The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 11, 2018

Filed:

Aug. 10, 2015
Applicant:

Intel Corporation, Santa Clara, CA (US);

Inventors:

Donald T. Tran, Phoenix, AZ (US);

Rajasekaran Swaminathan, Tempe, AZ (US);

Assignee:

INTEL CORPORATION, Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01R 12/00 (2006.01); H01R 12/72 (2011.01); H01R 43/20 (2006.01); H01R 13/6581 (2011.01); H01R 12/71 (2011.01); H01R 12/81 (2011.01); H01R 13/6592 (2011.01);
U.S. Cl.
CPC ...
H01R 12/721 (2013.01); H01R 12/714 (2013.01); H01R 12/81 (2013.01); H01R 13/6581 (2013.01); H01R 13/6592 (2013.01); H01R 43/205 (2013.01); Y10T 29/49174 (2015.01); Y10T 29/49176 (2015.01);
Abstract

Embodiments of the present disclosure are directed to an interconnect cable including a edge finger connector, and associated configurations and methods. The edge finger connector may be disposed at a first end of the interconnect cable and may connect the interconnect cable to an edge finger included in or coupled to a package substrate. The package substrate may be included in a processor package assembly, and a processor may be mounted on the substrate. The interconnect cable may include one or more elongate conductors, with contacts directly coupled to respective conductors. A second connector may be disposed at a second end of the interconnect cable, and may couple the interconnect cable to a small form-factor pluggable (SFP) case that is configured to connect the interconnect cable to an SFP cable. Other embodiments may be described and claimed.


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