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For the Inventor, By the Inventor

Phoenix, AZ, United States of America

Donald Tiendung Tran

This inventor holds 32 USPTO granted patents and 8 published patent applications and 2 EPO patents, primarily in High Bandwidth Networking. Top assignee: Intel Corporation. Active years: 2003-2023.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Donald Tiendung Tran. Retrieved from https://idiyas.com/inventor/donald-tiendung-tran

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 32 

% Patents Active = 37.5


Average Co-Inventor Count = 2.1

ph-index = 6

Forward Citations = 139(Granted Patents)


Company Filing History:

goldMedal32 out of 56,365 
 
Intel Corporation
 patents

Years Active: 2003-2023

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Areas of Expertise:
Co-packaged Optics
Socket
Connector
Interconnect Cable
Electronic Assembly
High Density Card Connector
Spring Assembly
Integrated Circuit
32 patents (USPTO):Explore Patents
1. 11830863 - Dual-sided co-packaged optics for high bandwidth networking applications (2023-11-28),
2. 11569596 - Pressure features to alter the shape of a socket (2023-01-31),
3. 11217573 - Dual-sided co-packaged optics for high bandwidth networking applications (2022-01-04),
4. 10541494 - Connector for processor package (2020-01-21),
5. 10109940 - Connector port frame for processor package (2018-10-23),
6. 10074920 - Interconnect cable with edge finger connector (2018-09-11),
7. 10044115 - Universal linear edge connector (2018-08-07),
8. 9929511 - Shielded high density card connector (2018-03-27),
9. 9692147 - Small form factor sockets and connectors (2017-06-27),
10. 9674954 - Chip package connector assembly (2017-06-06),
11. 9640880 - Cable connector (2017-05-02),
12. 9570386 - Flexible package-to-socket interposer (2017-02-14),
13. 9502800 - Double-mated edge finger connector (2016-11-22),
14. 9490560 - Multi-array bottom-side connector using spring bias (2016-11-08),
15. 9332643 - Interconnect architecture with stacked flex cable (2016-05-03),

Sure, let's compose an article about inventor Donald Tiendung Tran.

Title: The Innovative Mind of Donald Tiendung Tran

Introduction:

Donald Tiendung Tran, a brilliant inventor hailing from Phoenix, Arizona, is making waves in the world of technology with his prolific patent portfolio and groundbreaking innovations.

Latest Patents:

Tran's latest patents demonstrate his expertise in high-speed networking applications and socket technology. One of his recent inventions, "Dual-sided co-packaged optics for high bandwidth networking applications," revolutionizes electronic packages for optical to electrical switching. Another patent, "Pressure features to alter the shape of a socket," focuses on enhancing connections between sockets and substrates for improved performance.

Career Highlights:

With an impressive track record of 32 patents to his name, Donald Tiendung Tran is a key figure at Intel Corporation. His contributions to the company have significantly advanced the field of technology and positioned him as a pioneer in the industry.

Collaborations:

Tran collaborates closely with esteemed colleagues at Intel Corporation, including Srikant Nekkanty and Rajasekaran Swaminathan. Together, they form a formidable team driving innovation and excellence within the organization.

Conclusion:

Inventor Donald Tiendung Tran's dedication to pushing the boundaries of technology and his remarkable patent portfolio underscore his influential role in shaping the future of high-speed networking and socket technology. His innovative spirit continues to inspire and motivate others in the industry to strive for excellence.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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