The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 27, 2017

Filed:

Dec. 22, 2015
Applicant:

Intel Corporation, Santa Clara, CA (US);

Inventors:

Srikant Nekkanty, Chandler, AZ (US);

Donald T. Tran, Phoenix, AZ (US);

Gregorio R. Murtagian, Phoenix, AZ (US);

Assignee:

INTEL CORPORATION, Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01R 4/48 (2006.01); H01R 43/16 (2006.01); H05K 5/00 (2006.01); H01R 13/73 (2006.01);
U.S. Cl.
CPC ...
H01R 4/48 (2013.01); H01R 13/73 (2013.01); H01R 43/16 (2013.01); H05K 5/0086 (2013.01);
Abstract

An electronic device connection system includes a first electrical device and a second electrical device. The first electrical device includes a plurality of electrical connectors disposed in, on, or about at least a portion of an exterior surface of the first electrical device. The second electrical device includes a plurality of electrical contacts disposed in, on, or about at least a portion of an exterior surface of the second electrical device. A mechanical compressor exerts a force on at least one of the first electrical device or the second electrical device such that the electrical connections on the first electrical device physically and conductively couple to the electrical contacts on the second electrical device. The device casing may function as the mechanical compressor. The electrical connectors and/or electrical contacts may include injection molded connectors that include a conductive material dispersed in a thermoplastic matrix.


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