The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 31, 2023
Filed:
Mar. 27, 2020
Intel Corporation, Santa Clara, CA (US);
Steven A. Klein, Chandler, AZ (US);
Kuang Liu, Queen Creek, AZ (US);
Srikant Nekkanty, Chandler, AZ (US);
Feroz Mohammad, Chandler, AZ (US);
Donald Tiendung Tran, Phoenix, AZ (US);
Srinivasa Aravamudhan, Beaverton, OR (US);
Hemant Mahesh Shah, Hillsboro, OR (US);
Alexander W. Huettis, Hillsboro, OR (US);
Intel Corporation, Santa Clara, CA (US);
Abstract
Systems, apparatus, and/or processes directed to applying pressure to a socket to alter a shape of the socket to improve a connection between the socket and a substrate, printed circuit board, or other component. The socket may receive one or more chips, may be an interconnect, or may be some other structure that is part of a package. The shape of the socket may be flattened so that a side of the socket may form a high-quality physical and electrical coupling with the substrate.