The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 14, 2017
Filed:
Jun. 01, 2015
Applicant:
Intel Corporaton, Santa Cara, CA (US);
Inventors:
Donald T. Tran, Phoenix, AZ (US);
Zhichao Zhang, Chandler, AZ (US);
Assignee:
Intel Corporation, Santa Clara, CA (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 7/00 (2006.01); H01L 23/498 (2006.01); H01R 12/00 (2006.01); H05K 1/00 (2006.01); H01L 23/13 (2006.01); H01L 21/48 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/4985 (2013.01); H01L 21/486 (2013.01); H01L 21/4857 (2013.01); H01L 23/13 (2013.01); H01L 23/49811 (2013.01); H01L 23/49816 (2013.01); H01L 23/49822 (2013.01); H01L 23/49827 (2013.01); H01L 23/49833 (2013.01); H01L 23/49838 (2013.01); H01L 24/17 (2013.01); H01L 24/81 (2013.01); H01R 12/00 (2013.01); H05K 1/00 (2013.01); H01L 2224/1601 (2013.01); H01L 2224/16057 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/81801 (2013.01); H01L 2924/0002 (2013.01); H01L 2924/15313 (2013.01); Y10T 29/49204 (2015.01);
Abstract
A flexible interposer for the attachment of a microelectronic package to a microelectronic socket, wherein a first portion of the flexible substrate may be positioned between the microelectronic package and the microelectronic socket, and a second portion of the flexible interposer may extend from between the microelectronic package and the microelectronic socket to electrically contact an external component. In one embodiment, the external component may be a microelectronic substrate and the microelectronic socket may be attached to the microelectronic substrate.