The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 04, 2022

Filed:

Mar. 04, 2020
Applicant:

Intel Corporation, Santa Clara, CA (US);

Inventors:

Suresh V. Pothukuchi, Chandler, AZ (US);

Andrew Alduino, San Jose, CA (US);

Ravindranath V. Mahajan, Chandler, AZ (US);

Srikant Nekkanty, Chandler, AZ (US);

Ling Liao, Fremont, CA (US);

Harinadh Potluri, Milpitas, CA (US);

David M. Bond, Apex, NC (US);

Sushrutha Reddy Gujjula, Chandler, AZ (US);

Donald Tiendung Tran, Phoenix, AZ (US);

David Hui, Santa Clara, CA (US);

Vladimir Tamarkin, Huntingdon Valley, PA (US);

Assignee:

Intel Corporation, Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 25/16 (2006.01); H01L 23/367 (2006.01); H01L 23/40 (2006.01); H01L 23/473 (2006.01); H01L 23/538 (2006.01); H04Q 11/00 (2006.01);
U.S. Cl.
CPC ...
H01L 25/167 (2013.01); H01L 23/367 (2013.01); H01L 23/40 (2013.01); H01L 23/4006 (2013.01); H01L 23/473 (2013.01); H01L 23/5385 (2013.01); H01L 23/5386 (2013.01); H04Q 11/0005 (2013.01); H01L 2023/4031 (2013.01); H04Q 2011/0039 (2013.01);
Abstract

Embodiments disclosed herein include electronic packages for optical to electrical switching. In an embodiment, an electronic package comprises a first package substrate and a second package substrate attached to the first package substrate. In an embodiment, a die is attached to the second package substrate. In an embodiment, a plurality of photonics engines are attached to a first surface and a second surface of the first package substrate. In an embodiment, the plurality of photonics engines are communicatively coupled to the die through the first package substrate and the second package substrate.


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