IDiyas

For the Inventor, By the Inventor

Hadera, Israel

Rachel Gordin

USPTO Granted Patents = 14 

Average Co-Inventor Count = 3.1

ph-index = 3

Forward Citations = 26(Granted Patents)


Location History:

  • Hedera, IL (2014)
  • Haifa, IL (2012 - 2015)
  • Hadera, IL (2006 - 2016)

Company Filing History:

goldMedal14 out of 164,108 
 
International Business Machines Corporation
 patents

Years Active: 2006-2016

where 'Filed Patents' based on already Granted Patents

14 patents (USPTO):
1. 9397042 - Integrated helical multi-layer inductor structures (2016-07-19),
2. 9111933 - Stacked through-silicon via (TSV) transformer structure (2015-08-18),
3. 9105627 - Coil inductor for on-chip or on-chip stack (2015-08-11),
4. 8943456 - Layout determining for wide wire on-chip interconnect lines (2015-01-27),
5. 8793637 - Method and system for design and modeling of vertical interconnects for 3DI applications (2014-07-29),
6. 8448119 - Method and system for design and modeling of vertical interconnects for 3DI applications (2013-05-21),
7. 8347244 - Topologies and methodologies for AMS integrated circuit design (2013-01-01),
8. 8271913 - Method and system for design and modeling of transmission lines (2012-09-18),
9. 8056043 - Capacitance modeling (2011-11-08),
10. 8041546 - Capacitance modeling (2011-10-18),
11. 7797662 - Method and system for design and modeling of transmission lines (2010-09-14),
12. 7454733 - Interconnect-aware methodology for integrated circuit design (2008-11-18),
13. 7392490 - System and method of modelling capacitance of on-chip coplanar transmission line structures over a substrate (2008-06-24),
14. 7080340 - Interconnect-aware integrated circuit design (2006-07-18),

Title: Rachel Gordin: Innovator in Semiconductor Technology

Introduction

Rachel Gordin is a prominent inventor based in Hadera, Israel, known for her significant contributions to semiconductor technology. With a total of 14 patents to her name, she has made remarkable advancements in the field, particularly in the design of integrated circuits and power management systems.

Latest Patents

Among her latest patents is the "Integrated Helical Multi-Layer Inductor Structures." This invention involves a chip package that includes a chip stack and a thermal power plane with multiple dielectric layers and conductive connectors. The design allows for efficient power supply to the chip through a unique inductor structure formed by vias and connectors. Another notable patent is the "Stacked Through-Silicon Via (TSV) Transformer Structure," which features a distributed active transformer with primary and secondary windings. This innovative design enables energy transfer through magnetic flux, enhancing the efficiency of power management in semiconductor devices.

Career Highlights

Rachel Gordin is currently employed at International Business Machines Corporation (IBM), where she continues to push the boundaries of technology. Her work has been instrumental in developing advanced semiconductor solutions that cater to the growing demands of modern electronics.

Collaborations

Throughout her career, Rachel has collaborated with esteemed colleagues, including David Goren and Michael Zelikson. These partnerships have fostered a creative environment that has led to groundbreaking innovations in the semiconductor industry.

Conclusion

Rachel Gordin's contributions to semiconductor technology exemplify her dedication to innovation and excellence. Her patents reflect a deep understanding of complex systems and a commitment to advancing the field. As she continues her work at IBM, her impact on technology is sure to grow.

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