The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 11, 2015

Filed:

Nov. 04, 2011
Applicants:

Michael J. Shapiro, Austin, TX (US);

Gary D. Carpenter, Austin, TX (US);

Alan J. Drake, Austin, TX (US);

Rachel Gordin, Haifa, IL;

Edmund J. Sprogis, Underhill, VT (US);

Inventors:

Michael J. Shapiro, Austin, TX (US);

Gary D. Carpenter, Austin, TX (US);

Alan J. Drake, Austin, TX (US);

Rachel Gordin, Haifa, IL;

Edmund J. Sprogis, Underhill, VT (US);

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01F 5/00 (2006.01); H01L 27/08 (2006.01); H01L 23/498 (2006.01); H01L 23/522 (2006.01); H01L 23/64 (2006.01); H01L 49/02 (2006.01); H01F 17/00 (2006.01); H01F 41/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49822 (2013.01); H01F 17/0013 (2013.01); H01L 23/5227 (2013.01); H01L 23/645 (2013.01); H01L 28/10 (2013.01); H01F 41/005 (2013.01); H01F 2017/0086 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/73265 (2013.01); H01L 2924/01322 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/30107 (2013.01);
Abstract

A coil inductor and buck voltage regulator incorporating the coil inductor are provided which can be fabricated on a microelectronic element such as a semiconductor chip, or on an interconnection element such as a semiconductor, glass or ceramic interposer element. When energized, the coil inductor has magnetic flux extending in a direction parallel to first and second opposed surfaces of the microelectronic or interconnection element, and whose peak magnetic flux is disposed between the first and second surfaces. In one example, the coil inductor can be formed by first conductive lines extending along the first surface of the microelectronic or interconnection element, second conductive lines extending along the second surface of the microelectronic or interconnection element, and a plurality of conductive vias, e.g., through silicon vias, extending in direction of a thickness of the microelectronic or interconnection element. A method of making the coil inductor is also provided.


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