IDiyas

For the Inventor, By the Inventor

Shanghai, China

Qingqing Sun

USPTO Granted Patents = 21 

Average Co-Inventor Count = 3.9

ph-index = 2

Forward Citations = 19(Granted Patents)


Company Filing History:

goldMedal19 out of 207 
 
Fudan University
 patents
silverMedal4 out of 8 
 
Shanghai Integrated Circuit Manufacturing Innovation Center Co., Ltd.
 patents
bronzeMedal1 out of 1 
 
Shanghai Integrated Circuit Manuvacturing Innovation Center Co., Ltd
 patent
where one patent can have more than one assignee

Years Active: 2013-2024

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21 patents (USPTO):
1. 12159179 - Three-dimensional integrated system of RFID chip and super capacitor and preparation method thereof (2024-12-03),
2. 11887912 - Through silicon via structure for three-dimensional integrated circuit packaging and manufacturing method thereof (2024-01-30),
3. 11881442 - SOI active transfer board for three-dimensional packaging and preparation method thereof (2024-01-23),
4. 11869827 - Three-dimensional capacitor-inductor based on high functional density through silicon via structure and preparation method thereof (2024-01-09),
5. 11854939 - Three-dimensional integrated system of dram chip and preparation method thereof (2023-12-26),
6. 9748406 - Semi-floating-gate device and its manufacturing method (2017-08-29),
7. 9508811 - Semi-floating-gate device and its manufacturing method (2016-11-29),
8. 9431506 - Metal-oxide-semiconductor (MOS) transistor structure integrated with a resistance random access memory (RRAM) and the manufacturing methods thereof (2016-08-30),
9. 9263351 - Method of forming an integrated inductor by dry etching and metal filling (2016-02-16),
10. 9153500 - Method for improving the electromigration resistance in the copper interconnection process (2015-10-06),
11. 9147835 - Tunnel transistor structure integrated with a resistance random access memory (RRAM) and a manufacturing method thereof (2015-09-29),
12. 9099178 - Resistive random access memory with electric-field strengthened layer and manufacturing method thereof (2015-08-04),
13. 9054303 - Metal-oxide-semiconductor (MOS) transistor structure integrated with a resistance random access memory (RRAM) and the manufacturing methods thereof (2015-06-09),
14. 8994095 - Semiconductor memory device with a buried drain and its memory array (2015-03-31),
15. 8860179 - Inductive loop formed by through silicon via interconnection (2014-10-14),

Title: Innovator Spotlight: Qingqing Sun - Revolutionizing Integrated Circuit Packaging

Introduction:

Qingqing Sun, a prolific inventor based in Shanghai, China, is making significant strides in the field of integrated circuit packaging. With a remarkable portfolio of 20 patents to his name, Sun is a visionary in developing cutting-edge technologies that enhance production efficiency and reduce costs in the semiconductor industry.

Latest Patents:

1. Through Silicon Via Structure for Three-Dimensional Integrated Circuit Packaging and Manufacturing Method Thereof: Sun's innovative method involves implanting hydrogen ions into a silicon wafer to create a substrate for through silicon via formation. By utilizing advanced plasma etching techniques and precise material deposition processes, this patent aims to streamline the production of three-dimensional integrated circuits.

2. SOI Active Transfer Board for Three-Dimensional Packaging and Preparation Method Thereof: Sun's groundbreaking work focuses on utilizing an SOI substrate to develop an active interposer for three-dimensional packaging. By integrating CMOS inverter technology and via hole structures, this patent addresses key challenges such as short channel effects and latch-up effects in semiconductor devices.

Career Highlights:

Sun's expertise extends across prestigious institutions such as Fudan University and the Shanghai Integrated Circuit Manufacturing Innovation Center Co., Ltd. His contributions have not only advanced research in the academic sphere but have also catalyzed innovations in industrial settings.

Collaborations:

During his career, Sun has collaborated closely with distinguished professionals in the field, including Wei Zhang and Pengfei Wang. Together, they have synergized their talents to drive forward impactful projects and bring revolutionary ideas to fruition.

Conclusion:

Qingqing Sun's relentless pursuit of excellence and his commitment to pushing the boundaries of integrated circuit packaging have earned him a well-deserved reputation as a trailblazer in the industry. His inventive spirit, coupled with a strong collaborative ethos, continues to inspire breakthroughs that shape the future of semiconductor technology.

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