The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 03, 2024
Filed:
Jul. 02, 2020
Fudan University, Shanghai, CN;
Shanghai Integrated Circuit Manufacturing Innovation Center Co., Ltd, Shanghai, CN;
Fudan University, Shanghai, CN;
Shanghai Integrated Circuit Manuvacturing Innovation Center Co., Ltd, Shanghai, CN;
Abstract
The present disclosure discloses a three-dimensional integration system of an RFID chip and a supercapacitor and a manufacturing method thereof. The three-dimensional integration system of an RFID chip and a supercapacitor includes: a silicon substrate (); an RFID chip () disposed on a front surface of the silicon substrate (); a supercapacitor disposed on a back surface of the silicon substrate () at a position corresponding to the RFID chip (), but not in contact with the RFID chip (); through silicon via structures penetrating the silicon substrate () and respectively disposed on two sides of the RFID chip (); wherein the RFID chip () has a chip positive electrode () and a chip negative electrode () electrically connected with a capacitor contact positive electrode () and a capacitor contact negative electrode () of the supercapacitor through the through silicon via structures on the two sides respectively; and a packaging substrate () electrically connected to the capacitor contact positive electrode () and the capacitor contact negative electrode ().