The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 09, 2015

Filed:

Oct. 29, 2012
Applicant:

Fudan University, Shanghai, CN;

Inventors:

Xi Lin, Shanghai, CN;

Pengfei Wang, Shanghai, CN;

Qingqing Sun, Shanghai, CN;

Wei Zhang, Shanghai, CN;

Assignee:

Fudan University, Shanghai, CN;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 45/00 (2006.01); H01L 27/24 (2006.01); G11C 13/00 (2006.01);
U.S. Cl.
CPC ...
H01L 45/1206 (2013.01); H01L 45/16 (2013.01); H01L 45/1226 (2013.01); G11C 13/0002 (2013.01); H01L 45/04 (2013.01); H01L 45/1233 (2013.01); H01L 45/146 (2013.01); H01L 45/1616 (2013.01); H01L 27/2436 (2013.01);
Abstract

The present invention belongs to the technical field of semiconductor memories, in particular to a metal oxide semiconductor (MOS) transistor structure integrated with a resistance random access memory (RRAM). The MOS transistor structure comprises a MOS transistor and a RRAM formed on a substrate, wherein a gate dielectric layer of said MOS transistor extends to the surface of a drain region of said MOS transistor; and the part of the gate dielectric layer on the surface of the drain region of said MOS transistor faults a resistance-variable storage layer of said RRAM. In this invention, the high-quality dielectric layer of the MOS transistor and the resistance-variable storage layer of the RRAM are obtained by primary atomic layer deposition which integrates the RRAM and MOS transistor together without increasing steps. This process is simple and can combine the shallow trench isolation or field oxygen isolation and ion implantation or diffusion of source electrode and drain electrode to make integration convenient.


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