Weifang, China

Qinglin Song

USPTO Granted Patents = 14 

 

Average Co-Inventor Count = 3.2

ph-index = 2

Forward Citations = 14(Granted Patents)


Location History:

  • Beijing, CN (2012)
  • WeiFang, CN (2015 - 2022)
  • Shandong, CN (2019 - 2024)

Company Filing History:


Years Active: 2012-2024

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14 patents (USPTO):

Title: Innovations of Qinglin Song: A Trailblazer in SIP Packaging Technology

Introduction

Qinglin Song, an accomplished inventor based in Weifang, China, has made significant contributions to the field of electronic packaging. With a remarkable portfolio of 14 patents, his work primarily revolves around advanced methods and processes for System in Package (SIP) technology. His innovative spirit and technical expertise have positioned him as a key player in the industry.

Latest Patents

Among his latest patents, Qinglin's "Shielding process for SIP packaging" is particularly noteworthy. This invention involves a meticulous procedure that begins with providing a circuit board, followed by the formation of half-cut trenches that separate various SIP packaging modules. The process includes creating a metal overlay that ensures both conformal and compartment shielding, ultimately leading to distinct SIP modules.

Another significant patent is the "Packaging method for circuit units comprising circuit baseplate." This method innovatively combines circuit units that include a silicon layer substrate and a silicon dioxide layer. The packaging technique consists of attaching the circuit units to a circuit baseplate in a unique inverted arrangement, enhancing the overall functionality and reliability of electronic devices.

Career Highlights

Qinglin Song's career includes notable tenures at Goertek Inc. and Weifang Goertek Microelectronics Co., Ltd. His experience at these prominent companies has greatly influenced his innovative projects and technological advancements. His deep understanding of electronics has helped bridge the gap between theoretical knowledge and practical applications, making him a sought-after inventor in the field.

Collaborations

Throughout his career, Qinglin has collaborated with respected professionals such as Dewen Tian and Zhe Wang. These partnerships have fostered a collaborative environment that encourages the exchange of ideas and innovative solutions, helping to propel their joint endeavors to new heights.

Conclusion

Qinglin Song stands out as a leading inventor in SIP packaging technology, with a keen focus on creating inventive solutions that enhance electronic device performance. His impressive collection of patents and his collaborations with industry experts reflect his commitment to innovation and excellence in the electronics field. As technology continues to evolve, Qinglin's innovations will undoubtedly play a significant role in shaping the future of electronic packaging.

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