The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 08, 2019
Filed:
Dec. 10, 2015
Goertek.inc, Shandong, CN;
Goertek Inc., Weifang-Shandong, CN;
Abstract
Provided are an encapsulation structure and encapsulation method for an integrated sensor. The encapsulation structure comprises: a first substrate () and a first outer housing (), the first outer housing and first substrate enclosing a first encapsulation cavity; a plurality of sensors arranged inside the first encapsulation cavity, each of the sensors comprising MEMS sensor chips () and ASIC chips () electrically connected to the MEMS sensor chips; inside the first encapsulation cavity, the exterior of the ASIC chip of at least one of the sensors is provided with a shielding structure. Arranging a shielding structure on the exterior of the ASIC chip in the integrated sensor and likely to be subjected to interference causes the ASIC chip to be encapsulated in isolation from other sensor units, preventing the other sensor units in the integrated sensor from interfering with the ASIC chip, and effectively improving the performance of the sensor unit and the overall performance of the integrated sensor.