The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 21, 2012
Filed:
Oct. 30, 2007
Qinglin Song, Beijing, CN;
Yongchun Tao, Beijing, CN;
Shengli Pang, Beijing, CN;
Tongqing Liu, Beijing, CN;
Qinglin Song, Beijing, CN;
Yongchun Tao, Beijing, CN;
Shengli Pang, Beijing, CN;
Tongqing Liu, Beijing, CN;
Goer Tek Inc., Weifang, Shangdong Province, CH;
Abstract
Disclosed is a condenser microphone chip, comprising: a substrate (); a diaphragm () spaced from the substrate; a curved beam () connected with the diaphragm () to anchor the diaphragm () to the substrate (); a curved beam connecting part () having a shape of a substantially circular plate. The curved beam () is arranged in the diaphragm (). The curved beam () includes a plurality of sub beams, each of the plurality of sub beams including a first sub beam portion extending in a substantially radial direction from a circumference of the curved beam connecting part (); a second sub beam portion extending in a substantially circumferential direction from an end of the first sub beam portion away from the circumference of the curved beam connecting part () and having a shape of a substantial arc; and a third sub beam portion extending in the radial direction from an end of the second sub beam portion away from the first sub beam portion and connected to the diaphragm (). The condenser microphone chip according to the present invention is high in sensitivity, low in noise, wide in frequency band, simple in manufacturing process, and high in reliability. In addition, the condenser microphone chip can be easily manufactured in mass production.