The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 18, 2015

Filed:

Dec. 30, 2010
Applicants:

Zhe Wang, Singapore, SG;

Qinglin Song, WeiFang, CN;

Shengli Pang, WeiFang, CN;

Fanghui Gu, WeiFang, CN;

Inventors:

Zhe Wang, Singapore, SG;

Qinglin Song, WeiFang, CN;

Shengli Pang, WeiFang, CN;

Fanghui Gu, WeiFang, CN;

Assignee:

GOERTEK INC., Weifang, CN;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B81B 3/00 (2006.01); H04R 19/00 (2006.01); H04R 31/00 (2006.01); B81C 1/00 (2006.01); H04R 1/02 (2006.01);
U.S. Cl.
CPC ...
B81B 3/0018 (2013.01); B81C 1/00158 (2013.01); B81C 1/00246 (2013.01); H04R 19/005 (2013.01); H04R 31/00 (2013.01); B81B 2201/0257 (2013.01); B81B 2207/015 (2013.01); H04R 1/021 (2013.01); H04R 2201/003 (2013.01);
Abstract

The present invention relates to a MEMS microphone and a method of manufacturing the same, the MEMS microphone comprising: a monolithic silicon chip incorporating an acoustic sensing element and one or more conditioning CMOS integrated circuits; a silicon-based carrier chip having an acoustic cavity; a substrate for surface mounting the assembly of the monolithic chip and the silicon-based carrier chip thereon; a conductive cover attached and electrically connected to the substrate to accommodates the assembly of the monolithic chip and the silicon-based carrier chip; and an acoustic port formed on either the conductive cover or the substrate for an external acoustic wave to reach the acoustic sensing element, wherein the monolithic silicon chip, the silicon-based carrier chip and the acoustic port are configured in such a way that the diaphragm of the acoustic sensing element can be vibrated by the external sound wave from one side thereof.


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