Goertek Inc.

Weifang Goertek Microelectronics Co., Ltd.

Qinglin Song

Dewen Tian

Zhe Wang

Quanbo Zou

Mengjin Cai

Guanxun Qiu

Shengli Pang

Yongchun Tao

Debo Sun

Junkai Zhan

Xiaoyang Zhang

Zonglin Zhou

Jialiang Yan

Dexin Wang

Tongqing Liu

Huabin Fang

Yujing Lin

Kaiwei Wang

Fei She

Baoguan Yin

Dingguo Zhong

Haisheng Wang

Luyu Duanmu

Juncheng Guo

Junde Zhang

Fanghui Gu

Disclosed is a shielding process for SIP packaging, including: providing a circuit board; cutting the covering layer to form half-cut trenches separating different SIP packaging modules from each other, and to form grooves in each single SIP packaging module; forming a metal overlay, the metal overlay on an outer surface of the SIP packaging module and at positions where the half-cut trenches are located constituting a conformal shielding, the metal overlay at positions where the grooves are located constituting a compartment shielding; and cutting the half-cut trenches to obtain a plurality of SIP packaging modules that are separate from each other.

Shielding process for SIP packaging

Disclosed is a packaging method for circuit units, wherein the circuit units comprise a silicon layer substrate and a silicon dioxide layer overlaid on the silicon layer substrate. The packaging method for a circuit unit comprises: attaching a plurality of circuit units to a circuit baseplate in a spaced and inverted mode, wherein the silicon dioxide layer is attached to the circuit baseplate, and the silicon layer substrate faces away from the circuit baseplate; forming an insulator between the circuit units; removing the silicon layer substrate to expose the silicon dioxide layer; and forming an electromagnetic shielding layer on the silicon dioxide layer and the insulator.

Packaging method for circuit units comprising circuit baseplate

Disclosed is a method for detecting coverage rate of an intermetallic compound, the method comprising putting a chip subjected to wire bonding into a mixed reagent of fuming nitric acid and fuming sulfuric acid for soaking, wherein the chip subjected to wire bonding comprises a silver wire and an aluminum; taking out the chip after the silver wire is removed; and detecting the coverage rate of an intermetallic compound on the aluminum pad.

Method for detecting coverage rate of intermetallic compound

Disclosed is a method for packaging a chip, comprising the following steps: providing a baseplate formed with an open slot thereon penetrating through opposite sides of the baseplate; providing a release base material, wherein the release base material is bonded to a first side of the baseplate and covers the open slot; providing a chip, wherein the chip is mounted on the release base material at the position of the open slot; packaging a second side of the baseplate facing away from the release base material so as to form a packaging layer which packages the chip and fixes it on the baseplate; removing the release base material so as to obtain a package structure for the chip.

Method for packaging chip

Disclosed are an electromagnetic shielding structure and a manufacturing method thereof, and an electronic product. The manufacturing method includes covering an injection mold on a circuit substrate, so that different circuit units on the circuit substrate are respectively accommodated in different injection molding cavities of the injection mold; injecting a non-conductive plastic sealant into the injection molding cavities so as to form non-conductive plastic sealing bodies on the circuit units, wherein spacing grooves are formed between the non-conductive plastic sealing bodies; and forming a conductive shielding layer on the non-conductive plastic sealing bodies, so that the conductive shielding layer covers the non-conductive plastic sealing bodies and fills the spacing grooves to form shielding barrier walls, thereby realizing shielding between the different circuit units in respective cavities.

Electromagnetic shielding structure and manufacturing method thereof, and electronic device

An integrated structure of a MEMS microphone and an air pressure sensor, and a fabrication method for the integrated structure, the structure including a base substrate; a vibrating membrane, back electrode, upper electrode, and lower electrode formed on the base substrate, as well as a sacrificial layer formed between the vibrating membrane and the back electrode and between the upper electrode and the lower electrode; a first integrated circuit electrically connected to the vibrating membrane and the back electrode respectively; and a second integrated circuit electrically connected to the lower electrode and the upper electrode respectively, wherein a region of the base substrate corresponding to the vibrating membrane is provided with a back cavity; the sacrificial layer between the vibrating membrane and the back electrode is hollowed out to from a vibrating space that communicates with the exterior of the integrated structure, and the sacrificial layer between the upper electrode and the lower electrode is hollowed out to form a closed space; and the integrated circuits are formed on a chip, thereby reducing the interference of connection lines on the performance of a microphone, reducing the introduction of noise, reducing the size of a product and reducing power consumption.

Integrated structure of mems microphone and air pressure sensor and fabrication method thereof

Disclosed are a method for manufacturing a coil, a coil, and an electronic device. The method includes: bonding a first side of a metal sheet onto a laser-transmitting substrate by an adhesive layer; cutting a coil pattern on a second side of the metal sheet by the laser to form a coil running through the two sides of the metal sheet on the metal sheet; bonding the second side of the metal sheet onto an adhesive tape; transmitting the laser through the laser-transmitting substrate to act on the adhesive layer to detach the laser-transmitting substrate and the adhesive layer from the first side of the metal sheet; exposing the coil pattern on the first side of the metal sheet; and forming an encapsulation layer on the coil to encapsulate the first side of the coil.

Method for manufacturing coil, coil and electronic device

A micro laser diode projector comprises: an MEMS scanning device, which rotates around a first axis and a second axis that are orthogonal to each other; and a micro laser diode light source including at least one micro laser diode, wherein the micro laser diode light source is mounted on the MEMS scanning device and rotates around the first and second axes with the MEMS scanning device to project light to a projection screen. An electronics apparatus including the micro laser diode projector is also discussed.

Micro laser diode projector and electronics apparatus

An acoustic sensor integrated MEMS microphone structure and a fabrication method thereof. A diaphragm () and back-pole () which forms a condenser structure are formed on a substrate () having at least one recessed slot () on the top. A sensitive electrode is formed on the substrate (), the sensitive electrode comprising a fixed portion () fixed on the substrate () via a sacrificial layer (), and a bending portion () inserted into the recessed slot (), wherein the bending portion and the side wall of the recessed slot form the condenser structure. The integrated structure integrates the condenser structure of the microphone and condenser structure of the acoustic sensor on a substrate (), thereby increasing the integration level thereof and reducing the overall size of the package. Meanwhile, the microphone diaphragm () and the sensitive electrode of the acoustic sensor can be fabricated on a same substrate () at the same time, from the same material, and using the same fabricating process to increase production efficiency.

Acoustic sensor integrated MEMS microphone structure and fabrication method thereof

The present invention discloses a microphone, comprises: a silicon substrate; a diaphragm disposed over the silicon substrate; a backplate disposed over the diaphragm, the backplate having a plurality of through holes formed therein and a barrier structure, and the plurality of through holes being arranged in a through hole pattern on the backplate; the barrier structure having one or more protruding portions extending from at least one part of the through hole wall of the barrier structure, thereby the section shape of at least one through hole being an irregular shape with one or more inwardly concave portion. The microphone provided by the present invention can achieve a better dustproof effect.

Microphone with dustproof through holes

A method for forming a cavity of a sensor chip. The method comprises forming a first groove (a) on a substrate (a); bonding a covering layer (a) onto the substrate (a) to cover the first groove (a), thereby forming a cavity; and etching the covering layer (a) to decrease a thickness of the covering layer. The method can implement a thinner thickness of a film, thereby improving the sensitivity of a sensor.

Cavity forming method for a sensor chip, manufacturing method thereof, chip and electronics apparatus

Provided are an encapsulation structure and encapsulation method for an integrated sensor. The encapsulation structure comprises: a first substrate () and a first outer housing (), the first outer housing and first substrate enclosing a first encapsulation cavity; a plurality of sensors arranged inside the first encapsulation cavity, each of the sensors comprising MEMS sensor chips () and ASIC chips () electrically connected to the MEMS sensor chips; inside the first encapsulation cavity, the exterior of the ASIC chip of at least one of the sensors is provided with a shielding structure. Arranging a shielding structure on the exterior of the ASIC chip in the integrated sensor and likely to be subjected to interference causes the ASIC chip to be encapsulated in isolation from other sensor units, preventing the other sensor units in the integrated sensor from interfering with the ASIC chip, and effectively improving the performance of the sensor unit and the overall performance of the integrated sensor.

Packaging structure of integrated sensor

The present invention relates to a MEMS microphone and a method of manufacturing the same, the MEMS microphone comprising: a monolithic silicon chip incorporating an acoustic sensing element and one or more conditioning CMOS integrated circuits; a silicon-based carrier chip having an acoustic cavity; a substrate for surface mounting the assembly of the monolithic chip and the silicon-based carrier chip thereon; a conductive cover attached and electrically connected to the substrate to accommodates the assembly of the monolithic chip and the silicon-based carrier chip; and an acoustic port formed on either the conductive cover or the substrate for an external acoustic wave to reach the acoustic sensing element, wherein the monolithic silicon chip, the silicon-based carrier chip and the acoustic port are configured in such a way that the diaphragm of the acoustic sensing element can be vibrated by the external sound wave from one side thereof.

MEMS microphone and method for packaging the same

Disclosed is a condenser microphone chip, comprising: a substrate (); a diaphragm () spaced from the substrate; a curved beam () connected with the diaphragm () to anchor the diaphragm () to the substrate (); a curved beam connecting part () having a shape of a substantially circular plate. The curved beam () is arranged in the diaphragm (). The curved beam () includes a plurality of sub beams, each of the plurality of sub beams including a first sub beam portion extending in a substantially radial direction from a circumference of the curved beam connecting part (); a second sub beam portion extending in a substantially circumferential direction from an end of the first sub beam portion away from the circumference of the curved beam connecting part () and having a shape of a substantial arc; and a third sub beam portion extending in the radial direction from an end of the second sub beam portion away from the first sub beam portion and connected to the diaphragm (). The condenser microphone chip according to the present invention is high in sensitivity, low in noise, wide in frequency band, simple in manufacturing process, and high in reliability. In addition, the condenser microphone chip can be easily manufactured in mass production.

Growing community of inventors

Weifang, China

Qinglin Song