The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 16, 2022

Filed:

Sep. 05, 2017
Applicant:

Goertek, Inc., Weifang, CN;

Inventors:

Quanbo Zou, Weifang, CN;

Zhe Wang, Weifang, CN;

Qinglin Song, Weifang, CN;

Debo Sun, Weifang, CN;

Assignee:

Goertek Inc., Weifang, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01F 7/06 (2006.01); H01F 41/04 (2006.01); H01F 5/00 (2006.01); H01F 41/12 (2006.01);
U.S. Cl.
CPC ...
H01F 41/045 (2013.01); H01F 5/003 (2013.01); H01F 41/127 (2013.01);
Abstract

Disclosed are a method for manufacturing a coil, a coil, and an electronic device. The method includes: bonding a first side of a metal sheet onto a laser-transmitting substrate by an adhesive layer; cutting a coil pattern on a second side of the metal sheet by the laser to form a coil running through the two sides of the metal sheet on the metal sheet; bonding the second side of the metal sheet onto an adhesive tape; transmitting the laser through the laser-transmitting substrate to act on the adhesive layer to detach the laser-transmitting substrate and the adhesive layer from the first side of the metal sheet; exposing the coil pattern on the first side of the metal sheet; and forming an encapsulation layer on the coil to encapsulate the first side of the coil.


Find Patent Forward Citations

Loading…