The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 09, 2019
Filed:
Dec. 14, 2015
Goertek Inc., Shandong, CN;
Junkai Zhan, Shandong, CN;
Mengjin Cai, Shandong, CN;
Guanxun Qiu, Shandong, CN;
Zonglin Zhou, Shandong, CN;
Qinglin Song, Shandong, CN;
Goertek Inc., Shandong, CN;
Abstract
An acoustic sensor integrated MEMS microphone structure and a fabrication method thereof. A diaphragm () and back-pole () which forms a condenser structure are formed on a substrate () having at least one recessed slot () on the top. A sensitive electrode is formed on the substrate (), the sensitive electrode comprising a fixed portion () fixed on the substrate () via a sacrificial layer (), and a bending portion () inserted into the recessed slot (), wherein the bending portion and the side wall of the recessed slot form the condenser structure. The integrated structure integrates the condenser structure of the microphone and condenser structure of the acoustic sensor on a substrate (), thereby increasing the integration level thereof and reducing the overall size of the package. Meanwhile, the microphone diaphragm () and the sensitive electrode of the acoustic sensor can be fabricated on a same substrate () at the same time, from the same material, and using the same fabricating process to increase production efficiency.