The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 02, 2019
Filed:
Dec. 15, 2015
Applicant:
Goertek, Inc., Weifang, Shandong, CN;
Inventors:
Mengjin Cai, Weifang, CN;
Qinglin Song, Weifang, CN;
Assignee:
GOERTEK, INC., Weifang, Shandong, CN;
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/76 (2006.01); B81C 1/00 (2006.01);
U.S. Cl.
CPC ...
B81C 1/00047 (2013.01); B81C 1/00079 (2013.01); B81C 1/00158 (2013.01); B81C 1/00269 (2013.01); B81C 1/00555 (2013.01); B81B 2201/0264 (2013.01);
Abstract
A method for forming a cavity of a sensor chip. The method comprises forming a first groove (a) on a substrate (a); bonding a covering layer (a) onto the substrate (a) to cover the first groove (a), thereby forming a cavity; and etching the covering layer (a) to decrease a thickness of the covering layer. The method can implement a thinner thickness of a film, thereby improving the sensitivity of a sensor.