Richardson, TX, United States of America

Qi-Zhong Hong

This inventor holds 47 USPTO granted patents and 5 published patent applications and 1 EPO patent, primarily in Thin Film Resistors. Top assignees: Texas Instruments Corporation, International Business Machines Corporation. Active years: 1997-2025.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Qi-Zhong Hong. Retrieved from https://idiyas.com/inventor/qi-zhong-hong

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 47 

% Patents Active = 100.0

 

Average Co-Inventor Count = 2.5

ph-index = 13

Forward Citations = 491(Granted Patents)


Location History:

  • Dallas, TX (US) (1997 - 2004)
  • Richardson, TX (US) (2004 - 2023)

Company Filing History:


Years Active: 1997-2025

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Areas of Expertise:
Thin Film Resistor
Metal Interconnect
Dual Damascene
Dielectric Barrier
Silicide Formation
Integrated Circuit
Via Retardation Layer
Copper Metallization
Thermal Stability
Multilevel Via Placement
Oxide Filling
Surface Protective Layer
47 patents (USPTO):Explore Patents

Title: Innovations and Patents of Qi-Zhong Hong

Introduction

Qi-Zhong Hong, based in Richardson, TX, is an accomplished inventor with an impressive portfolio of 46 patents. His work primarily focuses on advanced integrated circuit technologies and thin film resistors, contributing significantly to the field of electronics and semiconductor devices.

Latest Patents

Qi-Zhong Hong's recent innovations include two notable patents. The first, titled "Thin Film Resistor with Punch-Through Vias," outlines a device featuring a thin film resistor (TFR) structure. This innovative design allows for accessibility through one or more conductive vias that extend vertically and penetrate the TFR layer completely. By etching a via trench and filling it with a conductor, this TFR structure enhances the performance of electronics.

The second patent, "IC with Thin Film Resistor with Metal Walls," describes an integrated circuit (IC) that integrates a TFR layer situated on an inter-level dielectric layer above a semiconductor surface layer. This design includes vertical metal walls that encapsulate the TFR on at least two sides, elevating the functionality and efficiency of circuit operations.

Career Highlights

Throughout his career, Qi-Zhong Hong has made significant contributions while working with industry leaders such as Texas Instruments Corporation and IBM. His extensive experience at these prestigious companies has allowed him to refine his skills in semiconductor technology and innovation.

Collaborations

Qi-Zhong has collaborated with several notable professionals in his field, including Wei-Yung Hsu and Abbas Ali. These partnerships have fostered a creative environment that promotes technological advancements and innovation.

Conclusion

In summary, Qi-Zhong Hong stands out as a distinguished inventor in the realm of electronics, with his 46 patents reflecting his dedication to enhancing integrated circuit technology. His innovative concepts in thin film resistors are paving the way for future developments in the semiconductor industry.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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