The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 07, 2017
Filed:
Dec. 19, 2014
Applicant:
Texas Instruments Incorporated, Dallas, TX (US);
Inventor:
Qi-Zhong Hong, Richardson, TX (US);
Assignee:
TEXAS INSTRUMENTS INCORPORATED, Dallas, TX (US);
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/44 (2006.01); G06F 17/50 (2006.01); H01L 23/522 (2006.01);
U.S. Cl.
CPC ...
G06F 17/5072 (2013.01); G06F 17/5081 (2013.01); H01L 23/5226 (2013.01); H01L 2924/0002 (2013.01);
Abstract
A method of operating a computer system to improve via electromigration in an integrated circuit with multilevel interconnect. A method of operating a computer system to improve via electromigration in an integrated circuit with multilevel interconnect using via priority groups.
Hong, Qi-Zhong. (2017). Multilevel via placement with improved yield in dual damascene interconnection (U.S. Patent No. 9589093). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9589093
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile