The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 02, 2025

Filed:

May. 24, 2022
Applicant:

Texas Instruments Incorporated, Dallas, TX (US);

Inventors:

Qi-Zhong Hong, Richardson, TX (US);

Joseph Jian Song, Plano, TX (US);

Gregory Boyd Shinn, Dallas, TX (US);

Bhaskar Srinivasan, Allen, TX (US);

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/768 (2006.01); H01L 21/02 (2006.01); H01L 23/522 (2006.01); H01L 23/532 (2006.01);
U.S. Cl.
CPC ...
H01L 21/76829 (2013.01); H01L 21/0217 (2013.01); H01L 21/02274 (2013.01); H01L 21/76877 (2013.01); H01L 23/5226 (2013.01); H01L 23/53238 (2013.01);
Abstract

An electronic device includes a semiconductor die having a multilevel metallization structure including stacked levels with respective dielectric layers and metal lines, and a low leakage, low hydrogen diffusion barrier layer on one of the stacked levels. The diffusion barrier layer contacts a side of the dielectric layer and the metal line of the one of the stacked levels, and the diffusion barrier layer includes silicon nitride material having a first bond percentage ratio of ammonia to silicon nitride that is greater than a second bond percentage ratio of silicon hydride to silicon nitride.


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