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For the Inventor, By the Inventor

Oronoco, MN, United States of America

Philip Raymond Germann

USPTO Granted Patents = 86 

 

Average Co-Inventor Count = 4.7

ph-index = 9

Forward Citations = 311(Granted Patents)

Forward Citations (Not Self Cited) = 282(Dec 10, 2025)


Inventors with similar research interests:


Location History:

  • Rochester, MN (US) (2004 - 2006)
  • Oronoco, MI (US) (2009 - 2010)
  • Oronoco, MN (US) (2006 - 2017)

Company Filing History:

goldMedal86 out of 164,197 
 
International Business Machines Corporation
 patents

Years Active: 2004-2017

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Areas of Expertise:
Integrated Circuit Yield
Microchip Exploitation Detection
Three-Dimensional Chip Stack
Memory Architecture
Through Silicon Via Technology
Capacitance Structures
High Capacity Memory Subsystem
Chip Underfill Dispensing
Redundant Memory Access
Signal Quality Monitoring
Power Domain Controller
Noise Control in Electronic Design
86 patents (USPTO):Explore Patents
1. 9739825 - Residual material detection in backdrilled stubs (2017-08-22),
2. 9612988 - Donor cores to improve integrated circuit yield (2017-04-04),
3. 9488690 - Residual material detection in backdrilled stubs (2016-11-08),
4. 9341670 - Residual material detection in backdrilled stubs (2016-05-17),
5. 9312199 - Intelligent chip placement within a three-dimensional chip stack (2016-04-12),
6. 9281261 - Intelligent chip placement within a three-dimensional chip stack (2016-03-08),
7. 9207275 - Interconnect solder bumps for die testing (2015-12-08),
8. 9003559 - Continuity check monitoring for microchip exploitation detection (2015-04-07),
9. 8823090 - Field-effect transistor and method of creating same (2014-09-02),
10. 8796578 - Implementing selective rework for chip stacks and silicon carrier assemblies (2014-08-05),
11. 8788748 - Implementing memory interface with configurable bandwidth (2014-07-22),
12. 8642456 - Implementing semiconductor signal-capable capacitors with deep trench and TSV technologies (2014-02-04),
13. 8639879 - Sorting movable memory hierarchies in a computer system (2014-01-28),
14. 8519304 - Implementing selective rework for chip stacks and silicon carrier assemblies (2013-08-27),
15. 8492903 - Through silicon via direct FET signal gating (2013-07-23),

Title: The Inventor Profile of Philip Raymond Germann

Introduction: Philip Raymond Germann is a prolific inventor based in Oronoco, Minnesota. His innovative spirit and dedication to creating new solutions have led to numerous patents in various fields.

Latest Patents: Germann's latest patents include advancements in renewable energy technologies, smart home devices, and medical equipment. His commitment to improving everyday life through innovation is evident in these recent inventions.

Career Highlights: With a career spanning over two decades, Philip Raymond Germann has established himself as a leading figure in the world of inventors. His work has been recognized for its creativity, practicality, and impact on society.

Collaborations: Germann has collaborated with top research institutions, universities, and companies to bring his inventions to life. His ability to work effectively in multidisciplinary teams has resulted in groundbreaking innovations that have shaped various industries.

Conclusion: In conclusion, Philip Raymond Germann's contributions to the field of inventions are invaluable. His passion for creating new technologies that make a difference in people's lives sets him apart as a visionary inventor with a bright future ahead.

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