The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 12, 2016

Filed:

Dec. 05, 2013
Applicant:

International Business Machines Corporation, Armonk, NY (US);

Inventors:

Gerald K. Bartley, Rochester, MN (US);

Darryl J. Becker, Rochester, MN (US);

Philip R. Germann, Oronoco, MN (US);

William P. Hovis, Rochester, MN (US);

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/66 (2006.01); H01L 23/34 (2006.01); H01L 23/538 (2006.01); H01L 27/06 (2006.01); H01L 23/36 (2006.01); H01L 23/48 (2006.01); H01L 23/00 (2006.01); H01L 25/065 (2006.01);
U.S. Cl.
CPC ...
H01L 23/34 (2013.01); H01L 22/20 (2013.01); H01L 23/36 (2013.01); H01L 23/481 (2013.01); H01L 23/5382 (2013.01); H01L 27/0688 (2013.01); H01L 22/14 (2013.01); H01L 24/05 (2013.01); H01L 24/06 (2013.01); H01L 24/13 (2013.01); H01L 24/16 (2013.01); H01L 25/0657 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/0557 (2013.01); H01L 2224/05568 (2013.01); H01L 2224/06181 (2013.01); H01L 2224/131 (2013.01); H01L 2224/16145 (2013.01); H01L 2225/06513 (2013.01); H01L 2225/06541 (2013.01); H01L 2225/06589 (2013.01); H01L 2924/37001 (2013.01);
Abstract

An integrated circuit (IC) stack device for thermal management is disclosed. The IC stack device can include a primary IC having a first set of cores with a ratio of first enabled cores and first disabled cores. The IC stack device can also have a supplementary IC interfaced with the primary IC, and having a second set of cores with a second ratio of second enabled cores and second disabled cores, with the second ratio being less than the first ratio. The integrated circuit stack device can also include a cooling element located such that the primary integrated circuit is between the cooling element and the supplementary integrated circuit. The cooling element can be designed to facilitate heat dissipation of the first and second enabled cores of the primary integrated circuit and the supplementary integrated circuit.


Find Patent Forward Citations

Loading…