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For the Inventor, By the Inventor

Munich, Germany

Peter Ossimitz

USPTO Granted Patents = 17


Average Co-Inventor Count = 1.7

ph-index = 3

Forward Citations = 64(Granted Patents)


Location History:

  • München, DE (2006 - 2009)
  • Munich, DE (2013 - 2018)

Company Filing History:

goldMedal17 out of 14,705 
 
Infineon Technologies Ag
 patents

Years Active: 2006-2018

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17 patents (USPTO):
1. 10090251 - Semiconductor chip having a dense arrangement of contact terminals (2018-10-02),
2. 9871017 - Multi-level chip interconnect (2018-01-16),
3. 9859251 - Semiconductor device having a chip under package (2018-01-02),
4. 9651630 - Circuitry and method for monitoring a power supply of an electronic device (2017-05-16),
5. 9385059 - Overmolded substrate-chip arrangement with heat sink (2016-07-05),
6. 9362187 - Chip package having terminal pads of different form factors (2016-06-07),
7. 9299673 - Method for manufacturing a semiconductor chip with each contact pad having a pad cell associated therewith (2016-03-29),
8. 9219031 - Chip arrangement, and method for forming a chip arrangement (2015-12-22),
9. 9204543 - Integrated IC package (2015-12-01),
10. 9082644 - Method of manufacturing and testing a chip package (2015-07-14),
11. 8799704 - Semiconductor memory component having a diverting circuit (2014-08-05),
12. 8779577 - Semiconductor chip comprising a plurality of contact pads and a plurality of associated pad cells (2014-07-15),
13. 8399265 - Device for releasably receiving a semiconductor chip (2013-03-19),
14. 7640469 - Electronic element comprising an electronic circuit which is to be tested and test system arrangement which is used to test the electronic element (2009-12-29),
15. 7560801 - Rewiring substrate strip with several semiconductor component positions (2009-07-14),

Title: The Innovations of Peter Ossimitz

Introduction

Peter Ossimitz is a prominent inventor based in Munich, Germany. He has made significant contributions to the field of semiconductor technology, holding a total of 17 patents. His work focuses on enhancing the performance and efficiency of semiconductor chips, which are crucial components in modern electronic devices.

Latest Patents

Among his latest patents is a groundbreaking design for a semiconductor chip that features a dense arrangement of contact terminals. This innovative chip includes a semiconductor body with an active device region and multiple metallization layers that are insulated from the semiconductor body. These layers are designed to carry ground, power, and signals to the active device region. The chip's design allows for a minimum distance between adjacent contact terminals, optimizing space and functionality. Additionally, Ossimitz has developed a multi-level chip interconnect that enhances the electrical performance of interconnectivity components in multi-layer integrated circuits. This advancement is vital for improving the connectivity of chip dice to external circuits and systems.

Career Highlights

Peter Ossimitz has built a successful career at Infineon Technologies AG, a leading company in semiconductor solutions. His expertise in semiconductor technology has positioned him as a key player in the industry. His contributions have not only advanced the technology but have also paved the way for future innovations in the field.

Collaborations

Throughout his career, Ossimitz has collaborated with notable colleagues, including Gottfried Beer and Matthias Von Daak. These partnerships have fostered a collaborative environment that encourages innovation and the sharing of ideas.

Conclusion

Peter Ossimitz's work in semiconductor technology exemplifies the spirit of innovation. His patents and contributions continue to influence the industry, making him a significant figure in the world of electronics. His dedication to advancing semiconductor technology will undoubtedly lead to further breakthroughs in the future.

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