The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 07, 2016
Filed:
Jan. 18, 2013
Applicant:
Infineon Technologies Ag, Neubiberg, DE;
Inventor:
Peter Ossimitz, Munich, DE;
Assignee:
Infineon Technologies AG, Neubiberg, DE;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/58 (2006.01); H01L 23/48 (2006.01); G01R 31/26 (2014.01); H01L 21/66 (2006.01); H01L 23/498 (2006.01);
U.S. Cl.
CPC ...
H01L 22/32 (2013.01); H01L 23/49838 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/73204 (2013.01); H01L 2224/73265 (2013.01);
Abstract
A chip package includes an integrated circuit chip. A first group of terminal pads of the chip package is electrically connected to the integrated circuit chip and a second group of terminal pads of the chip package is electrically connected to the integrated circuit chip. The first and second groups of terminal pads are arranged on a common terminal surface of the chip package. A pad size of a terminal pad of the first group of terminal pads is greater than a pad size of a terminal pad of the second group of terminal pads.