The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 16, 2018
Filed:
Jan. 04, 2016
Applicant:
Infineon Technologies Ag, Neubiberg, DE;
Inventors:
Peter Ossimitz, Munich, DE;
Tobias Jacobs, Dresden, DE;
Assignee:
Infineon Technologies AG, Neubiberg, DE;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 25/065 (2006.01); H01L 23/522 (2006.01); H01L 23/528 (2006.01); H01L 23/31 (2006.01); H01L 23/532 (2006.01); H01L 21/66 (2006.01); H01L 25/00 (2006.01); H01L 21/768 (2006.01);
U.S. Cl.
CPC ...
H01L 25/0652 (2013.01); H01L 21/76877 (2013.01); H01L 22/32 (2013.01); H01L 23/3171 (2013.01); H01L 23/528 (2013.01); H01L 23/5226 (2013.01); H01L 23/53219 (2013.01); H01L 23/53228 (2013.01); H01L 25/50 (2013.01); H01L 2225/06513 (2013.01);
Abstract
Representative implementations of devices and techniques provide optimized electrical performance of interconnectivity components of multi-layer integrated circuits (IC) such as chip dice, for example. Different layers of the multi-layer IC include contact terminals that may be used to connect to circuits, systems, and carriers external to the IC.