The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 14, 2015
Filed:
Jan. 18, 2013
Applicant:
Infineon Technologies Ag, Neubiberg, DE;
Inventors:
Assignee:
Infineon Technologies AG, Neubiberg, DE;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/66 (2006.01); G01R 31/28 (2006.01);
U.S. Cl.
CPC ...
H01L 22/10 (2013.01); G01R 31/2884 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/48091 (2013.01);
Abstract
A method of producing and testing a chip package is described. The chip package to be produced includes a semiconductor chip containing an integrated circuit and a reinforcing structure attached to the semiconductor chip. Further, the chip package has a lower main face and an upper main face opposite to the lower main face, wherein the lower main face is at least partly formed by an exposed surface of the semiconductor chip and the upper main face is formed by a terminal surface of the reinforcing structure on which external terminal pads of the chip package are arranged. After production, the package is subjected to a package-level burn-in test.