The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 01, 2015
Filed:
Dec. 03, 2013
Applicant:
Infineon Technologies Ag, Neubiberg, DE;
Inventor:
Peter Ossimitz, Munich, DE;
Assignee:
Infineon Technologies AG, Neubiberg, DE;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/52 (2006.01); H01L 23/48 (2006.01); H05K 1/11 (2006.01); H05K 1/09 (2006.01); H05K 1/18 (2006.01); H05K 3/10 (2006.01);
U.S. Cl.
CPC ...
H05K 1/111 (2013.01); H05K 1/09 (2013.01); H05K 1/181 (2013.01); H05K 3/10 (2013.01); H05K 2201/10234 (2013.01); H05K 2201/10734 (2013.01);
Abstract
An Integrated Circuit (IC) package comprises a package comprising a first set of pads having a pinout that is compatible with a chip core of a product family. A second set of pads are on substantially the same plane as the first set of pads and outside the package core. The second set of pads is configured to accommodate a circuit outside the chip core. The geometric center of the package core is different from the geometric center of the IC package.