The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 29, 2016

Filed:

May. 28, 2014
Applicant:

Infineon Technologies Ag, Neubiberg, DE;

Inventors:

Peter Ossimitz, Munich, DE;

Matthias Von Daak, Markt Schwaben, DE;

Dirk Hesidenz, Sauerlach, DE;

Assignee:

Infineon Technologies AG, Neubiberg, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/768 (2006.01); H01L 23/485 (2006.01); H01L 23/48 (2006.01); H01L 23/00 (2006.01); G11C 5/06 (2006.01); H01L 23/50 (2006.01); H01L 21/66 (2006.01); H01L 23/528 (2006.01);
U.S. Cl.
CPC ...
H01L 24/09 (2013.01); G11C 5/06 (2013.01); H01L 22/32 (2013.01); H01L 23/50 (2013.01); H01L 23/5286 (2013.01); H01L 24/03 (2013.01); H01L 24/06 (2013.01); H01L 24/85 (2013.01); H01L 24/05 (2013.01); H01L 24/48 (2013.01); H01L 2224/02166 (2013.01); H01L 2224/02379 (2013.01); H01L 2224/0392 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/04042 (2013.01); H01L 2224/05022 (2013.01); H01L 2224/05147 (2013.01); H01L 2224/05548 (2013.01); H01L 2224/05553 (2013.01); H01L 2224/05554 (2013.01); H01L 2224/05567 (2013.01); H01L 2224/05624 (2013.01); H01L 2224/06135 (2013.01); H01L 2224/06137 (2013.01); H01L 2224/09179 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/85 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/10253 (2013.01); H01L 2924/3011 (2013.01);
Abstract

Embodiments of the present invention relate to a semiconductor chip comprising a plurality of contact pads, which are arranged in an edge area on a surface of the semiconductor chip. In a semiconductor area of the semiconductor chip, every contact pad of the plurality of contact pads has an associated pad cell provided, which includes at least one of a driver or a receiver and is configured to drive output signals or receive input signals on its associated contact pad, if the driver or receiver is connected to the contact pad. Additionally, for a contact pad which is used as a supply contact pad, the driver or receiver of the associated pad cell is not connected to the contact pad or any other contact pad for driving output signals or receiving input signals on the same.


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