Gunma, Japan

Nobuyuki Takai

This inventor holds 11 USPTO granted patents. Top assignees: Sanyo Electric Co., Ltd., Semiconductor Components Industries, LLC. Active years: 2001-2012.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Nobuyuki Takai. Retrieved from https://idiyas.com/inventor/nobuyuki-takai

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 90.9

Average Co-Inventor Count = 4.1

ph-index = 8

Forward Citations = 348(Granted Patents)


Location History:

  • Gunma, JP (2001 - 2003)
  • Saitama, JP (2007)
  • Kumagaya, JP (2011)
  • Osato-gun, JP (2007 - 2012)

Company Filing History:


Years Active: 2001-2012

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11 patents (USPTO):Explore Patents

Title: Nobuyuki Takai: Innovator in Semiconductor Technology

Introduction

Nobuyuki Takai is a prominent inventor based in Gunma, Japan, known for his significant contributions to semiconductor technology. With a total of 11 patents to his name, Takai has made remarkable advancements in the manufacturing processes of semiconductor devices.

Latest Patents

One of his latest patents is a method of manufacturing a semiconductor device with wiring on the side surface, which reduces costs and improves reliability in Ball Grid Array (BGA) type semiconductor devices. This innovation involves forming a first wiring on an insulation film on the surface of a semiconductor die, bonding a glass substrate over the die, and covering the side and back surfaces with an insulation film. A second wiring connects to the side or back surface of the first wiring, extending over the back surface, with a conductive terminal formed on the second wiring.

Another notable patent is for a semiconductor device with a passivation layer covering the wiring layer. This invention enhances the yield of semiconductor devices by utilizing a bonding pad made of a wiring layer that includes aluminum. The manufacturing method involves removing a portion of an antireflection layer formed on the uppermost second wiring layer, forming a passivation layer, and dividing the semiconductor substrate into multiple dice. This process prevents the antireflection layer from being exposed, thus avoiding elution of components from the second wiring layer.

Career Highlights

Throughout his career, Nobuyuki Takai has worked with notable companies such as Sanyo Electric Co., Ltd. and Sanyo Electric Co., Ltd. His expertise in semiconductor technology has positioned him as a key figure in the industry.

Collaborations

Takai has collaborated with several professionals in the field, including Hiroyuki Shinogi and Ryoji Tokushige. Their combined efforts have contributed to the advancement of semiconductor manufacturing techniques.

Conclusion

Nobuyuki Takai's innovative work in semiconductor technology has led to significant improvements in manufacturing processes and device reliability. His contributions continue to influence the industry and pave the way for future advancements.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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