The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 18, 2003
Filed:
Oct. 06, 2000
Applicant:
Inventors:
Assignee:
Sanyo Electric Co., Ltd., Osaka, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 2/1301 ;
U.S. Cl.
CPC ...
H01L 2/1301 ;
Abstract
After a metal post is formed on a semiconductor wafer a groove is formed in a first dicing step. The semiconductor wafer is resin-sealed by a rein layer R from its upper surface. The semiconductor wafer is ground from its lower surface to a depth reaching the bottom of the groove so that the semiconductor wafer is divided into individual chips A. The resin layer is ground to expose the head of the metal post. After a solder ball is loaded on the metal post the portion of the resin layer between adjacent chips A is diced in a second dicing step so that the individual chips A are separated from one another.