The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 01, 2011
Filed:
Mar. 22, 2006
Nobuyuki Takai, Kumagaya, JP;
Takuya Suzuki, Kazo, JP;
Yuji Tsukada, Ora-gun, JP;
Sanyo Electric Co., Ltd., Moriguchi-shi, JP;
Abstract
The invention provides a semiconductor device with a bonding pad made of a wiring layer including aluminum and its manufacturing method that enhance the yield of the semiconductor device. The method of manufacturing the semiconductor device of the invention includes removing a portion of an antireflection layer (e.g. made of a titanium alloy) formed on an uppermost second wiring layer (e.g. made of aluminum) on a semiconductor substrate by etching, forming a passivation layer covering the antireflection layer and a portion of the second wiring layer where the antireflection layer is not formed and having an opening exposing the other portion of the second wiring layer, and dividing the semiconductor substrate into a plurality of semiconductor dice by dicing. These processes can prevent the antireflection layer from being exposed in the opening, and this can prevent a component of the second wiring layer from being eluted due to cell reaction between the second wiring layer and the antireflection layer as has been seen in the conventional art.