The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 23, 2002
Filed:
Feb. 08, 2000
Applicant:
Inventors:
Hiroyuki Shinogi, Gunma, JP;
Nobuyuki Takai, Gunma, JP;
Ryoji Tokushige, Gunma, JP;
Katsuhiko Kitagawa, Gunma, JP;
Assignee:
Sanyo Electric Co., Ltd., Osaka, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 2/328 ;
U.S. Cl.
CPC ...
H01L 2/328 ;
Abstract
To improve the moisture resistance of a chip size package, a seal ring is made up of tungsten plugs and metal electrodes and Further, a spacer is formed on both or either of a first flank and a second flank . The spacer can be formed on all interlayer insulating films extended to a dicing line part whereby multiple seal rings can be provided.
Shinogi, Hiroyuki. (2002). Semiconductor device (U.S. Patent No. 6424051). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6424051
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile