The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 11, 2001
Filed:
Jan. 24, 2000
Ryoji Tokushige, Gunma, JP;
Nobuyuki Takai, Gunma, JP;
Hiroyuki Shinogi, Gunma, JP;
Yukihiro Takao, Gunma, JP;
Sanyo Eelctric Co., Ltd., Osaka, JP;
Abstract
A process of exposing the head of a metal post used with a chip size package is simplified. A first semiconductor manufacturing method comprising the steps of forming an insulating resin layer R so as to completely cover the top of a metal post,and then polishing the resin layer so as to expose the head of the metal post, and a second semiconductor manufacturing method comprising the steps of forming an insulating resin layer R so as to completely cover the top of the metal post,, then back grinding the wafer rear face, and then polishing the resin layer R so as to expose the head of the metal post are provided.