Yokohama, Japan

Nobuyuki Kurashima

This inventor holds 20 USPTO granted patents and 2 EPO patents, primarily in Semiconductor Manufacturing. Top assignees: Kabushiki Kaisha Toshiba, Jsr Corporation. Active years: 2004-2013.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Nobuyuki Kurashima. Retrieved from https://idiyas.com/inventor/nobuyuki-kurashima-21l4nkhc

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

% Patents Active = 45.0


Average Co-Inventor Count = 4.0

ph-index = 5

Forward Citations = 87(Granted Patents)


Location History:

  • Kanagawa, JP (2005 - 2009)
  • Yokohama, JP (2004 - 2012)
  • Yokohama, PA (2012)
  • Yokohoma, JP (2005 - 2013)

Company Filing History:


Years Active: 2004-2013

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Areas of Expertise:
Semiconductor Device
Manufacturing Method
CMP Slurry
Polishing Method
Post-CMP Treatment
Aqueous Dispersion
Chemical Mechanical Polishing
Silicon Carbide
Dummy Wire
Discontinuous Film
Film Polishing
Fabrication Technique
20 patents (USPTO):Explore Patents

Title: Inventor Profile: Nobuyuki Kurashima

Introduction

Nobuyuki Kurashima is a distinguished inventor based in Yokohama, Japan, known for his innovative contributions in the field of semiconductor technology. With a remarkable portfolio of 20 patents, Kurashima's work continues to drive advancements in semiconductor device manufacturing.

Latest Patents

Kurashima has been instrumental in developing cutting-edge methodologies including a semiconductor device manufacturing method that emphasizes precision through temperature control during the polishing process. His latest patents detail a unique approach where the entrance temperature of the polishing pad is meticulously managed to enhance the quality of the semiconductor substrate. This method includes first polishing at temperatures ranging from 40°C to 50°C and a second polishing phase at temperatures of 30°C or lower, ensuring optimal results.

Another notable invention is a chemically-mechanical polishing (CMP) slurry for metallic films. This formulation comprises water, polyvinylpyrrolidone, oxidizing agents, and specialized complexing agents tailored for forming both water-soluble and insoluble complexes. The innovativeness of this CMP slurry lies in its effectiveness in achieving fine finishes on semiconductor devices, essential for modern electronic applications.

Career Highlights

Throughout his career, Nobuyuki Kurashima has significantly impacted the semiconductor industry while working for leading organizations such as Kabushiki Kaisha Toshiba and JSR Corporation. His expertise has helped these companies to enhance their technological capabilities and maintain a competitive edge in a rapidly evolving market.

Collaborations

Kurashima has collaborated with notable industry professionals, including Gaku Minamihaba and Hiroyuki Yano. These collaborations have facilitated the sharing of knowledge and expertise essential for pioneering new inventions and improving existing methodologies in semiconductor technology.

Conclusion

Nobuyuki Kurashima's contributions to the field of semiconductor manufacturing are noteworthy. With a strong focus on innovation, his patents showcase a commitment to enhancing device performance and manufacturing processes. As he continues to push the boundaries of technology, his work undoubtedly enriches the landscape of modern electronics and semiconductor development.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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