Company Filing History:

20 out of 52,711

Kabushiki Kaisha Toshiba

where one patent can have more than one assignee

Years Active: 2004-2013

where 'Filed Patents' based on already Granted Patents

20 patents (USPTO):Sort by Forward Citations

Abstract keywords

1. 8575030 - Semiconductor device manufacturing method (2013-11-05),

2. 8337715 - CMP slurry for metallic film, polishing method and method of manufacturing semiconductor device (2012-12-25),

3. 8174125 - Manufacturing method of a semiconductor device (2012-05-08),

4. 7951717 - Post-CMP treating liquid and manufacturing method of semiconductor device using the same (2011-05-31),

5. 7842191 - CMP slurry for metallic film, polishing method and method of manufacturing semiconductor device (2010-11-30),

6. 7833431 - Aqueous dispersion for CMP, polishing method and method for manufacturing semiconductor device (2010-11-16),

7. 7825028 - Method of manufacturing semiconductor device (2010-11-02),

8. 7655559 - Post-CMP treating liquid and manufacturing method of semiconductor device using the same (2010-02-02),

9. 7521350 - Manufacturing method of a semiconductor device (2009-04-21),

10. 7494931 - Method for fabricating semiconductor device and polishing method (2009-02-24),

11. 7307344 - Semiconductor device including a discontinuous film and method for manufacturing the same (2007-12-11),

12. 7198729 - CMP slurry and method of manufacturing semiconductor device (2007-04-03),

13. 7042099 - Semiconductor device containing a dummy wire (2006-05-09),

14. 6995090 - Polishing slurry for use in CMP of SiC series compound, polishing method, and method of manufacturing semiconductor device (2006-02-07),

15. 6945854 - Semiconductor device fabrication method and apparatus (2005-09-20),

Title: Inventor Profile: Nobuyuki Kurashima

Introduction

Nobuyuki Kurashima is a distinguished inventor based in Yokohama, Japan, known for his innovative contributions in the field of semiconductor technology. With a remarkable portfolio of 20 patents, Kurashima's work continues to drive advancements in semiconductor device manufacturing.

Latest Patents

Kurashima has been instrumental in developing cutting-edge methodologies including a semiconductor device manufacturing method that emphasizes precision through temperature control during the polishing process. His latest patents detail a unique approach where the entrance temperature of the polishing pad is meticulously managed to enhance the quality of the semiconductor substrate. This method includes first polishing at temperatures ranging from 40°C to 50°C and a second polishing phase at temperatures of 30°C or lower, ensuring optimal results.

Another notable invention is a chemically-mechanical polishing (CMP) slurry for metallic films. This formulation comprises water, polyvinylpyrrolidone, oxidizing agents, and specialized complexing agents tailored for forming both water-soluble and insoluble complexes. The innovativeness of this CMP slurry lies in its effectiveness in achieving fine finishes on semiconductor devices, essential for modern electronic applications.

Career Highlights

Throughout his career, Nobuyuki Kurashima has significantly impacted the semiconductor industry while working for leading organizations such as Kabushiki Kaisha Toshiba and JSR Corporation. His expertise has helped these companies to enhance their technological capabilities and maintain a competitive edge in a rapidly evolving market.

Collaborations

Kurashima has collaborated with notable industry professionals, including Gaku Minamihaba and Hiroyuki Yano. These collaborations have facilitated the sharing of knowledge and expertise essential for pioneering new inventions and improving existing methodologies in semiconductor technology.

Conclusion

Nobuyuki Kurashima's contributions to the field of semiconductor manufacturing are noteworthy. With a strong focus on innovation, his patents showcase a commitment to enhancing device performance and manufacturing processes. As he continues to push the boundaries of technology, his work undoubtedly enriches the landscape of modern electronics and semiconductor development.

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2 patents (EPO):

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