The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 7655559 B1

PDF
Full Text
Expired
Date of Patent:
Feb. 02, 2010

Filed:

Oct. 24, 2006
Applicants:

Nobuyuki Kurashima, Yokohama, JP;

Gaku Minamihaba, Yokohama, JP;

Hiroyuki Yano, Yokohama, JP;

Inventors:

Nobuyuki Kurashima, Yokohama, JP;

Gaku Minamihaba, Yokohama, JP;

Hiroyuki Yano, Yokohama, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/20 (2006.01);
U.S. Cl.
CPC ...
Abstract

A post CMP treating liquid is provided, which includes water, resin particles having, on their surfaces, carboxylic group and sulfonyl group, and a primary particle diameter ranging from 10 to 60 nm, a first surfactant having carboxylic group, a second surfactant having sulfonyl group, and tetramethyl ammonium hydroxide. The resin particles are incorporated at a concentration ranging from 0.01 to 1 wt %. The treating liquid has a pH ranging from 4 to 9, and exhibits a polishing rate both of an insulating film and a conductive film at a rate of 10 nm/min or less.


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Kurashima, Nobuyuki. (2010). Post-cmp treating liquid and manufacturing method of semiconductor device using the same (U.S. Patent No. 7655559). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7655559

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