The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 25, 2012

Filed:

Nov. 12, 2010
Applicants:

Gaku Minamihaba, Yokohama, JP;

Dai Fukushima, Kamakura, JP;

Nobuyuki Kurashima, Yokohama, PA;

Susumu Yamamoto, Yokohama, JP;

Hiroyuki Yano, Yokohama, JP;

Inventors:

Gaku Minamihaba, Yokohama, JP;

Dai Fukushima, Kamakura, JP;

Nobuyuki Kurashima, Yokohama, PA;

Susumu Yamamoto, Yokohama, JP;

Hiroyuki Yano, Yokohama, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C09K 13/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

A CMP slurry for metallic film is provided, which includes water, 0.01 to 0.3 wt %, based on a total quantity of the slurry, of polyvinylpyrrolidone having a weight average molecular weight of not less than 20,000, an oxidizing agent, a protective film-forming agent containing a first complexing agent for forming a water-insoluble complex and a second complexing agent for forming a water-soluble complex, and colloidal silica having a primary particle diameter ranging from 5 to 50 nm.


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