The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 16, 2010

Filed:

Nov. 17, 2006
Applicants:

Gaku Minamihaba, Yokohama, JP;

Nobuyuki Kurashima, Yokohama, JP;

Dai Fukushima, Kamakura, JP;

Yukiteru Matsui, Yokohama, JP;

Susumu Yamamoto, Oita, JP;

Hiroyuki Yano, Yokohama, JP;

Inventors:

Gaku Minamihaba, Yokohama, JP;

Nobuyuki Kurashima, Yokohama, JP;

Dai Fukushima, Kamakura, JP;

Yukiteru Matsui, Yokohama, JP;

Susumu Yamamoto, Oita, JP;

Hiroyuki Yano, Yokohama, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B44C 1/22 (2006.01); H01L 21/302 (2006.01); C09K 13/00 (2006.01); C03C 15/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

An aqueous dispersion for chemical mechanical polishing is provided, which includes water and a resin particle. The resin particles accompany with a projection having a curvature radius ranging from 10 nm to 1.65 μm on a surface. The maximum length of the resin particles is not more than 5 μm and is 2.5 to 25 times as large as the curvature radius.


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